Molex’s Co-Packaged Copper connector system

Molex has launched Impress Co-Packaged Copper Solutions to deliver high-speed data transmission with signal integrity.

Impress provides a compression-based, substrate connector and mating cable assembly that supports data rates up to 224Gbps PAM-4 and beyond

The system is available now for applications requiring data rates up to 224Gbps PAM-4. Development work is underway to validate the product for use with 336G and 448G applications.


“Impress is built to help scale infrastructures without exponential increases in power consumption or cost. By enabling high performance at the rack level, Molex is making next-generation compute more technically and economically viable,” says Molex vp Jairo Guerrero.


Molex’s Co-Packaged Copper connector system

Impress  places the connection point directly onto the ASIC package substrate. This two-piece connector system shrinks the distance signals must travel through the Pub.

The result is a full-channel solution with complete isolation from the substrate to the interconnect, reducing signal loss and crosstalk.

The Impress socket is compression-attached to the substrate, preventing damage to this layer while simplifying rework, maintenance and upgrades.

Impress has  over-moulded cable strain relief and a mechanical contact wipe feature to reinforce long-term mating durability.

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David Manners

David Manners

David Manners has more than forty-years experience writing about the electronics industry, its major trends and leading players. As well as writing business, components and research news, he is the author of the site's most popular blog, Mannerisms. This features series of posts such as Fables, Markets, Shenanigans, and Memory Lanes, across a wide range of topics.

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