We caught up with Coilcraft in Nuremberg at Embedded World 2024 as part of our promotional coverage for the event. Len Crane – Senior Technologist – discusses power inductors and how predicting performance gets better with Coilcraft MAGPro tools. He covers, for example, making inductors smaller and more compatible with surrounding components, making solutions better and smaller. Thank you to Len ...
We caught up with Siglent in Nuremberg at Embedded World 2024 as part of our promotional coverage for the event. Thomas Rottach – Sales & Marketing Director of Siglent – discusses presenting the company’s new flagship oscilloscope, the SDS7000A, at the show. He covers, for example, its 4GHz frequency range and vertical resolution of 12 bits, enabling the company to ...
We caught up with F&S in Nuremberg at Embedded World 2024 as part of our promotional coverage for the event. Holger Frölich – Managing Director of F&S – discusses the company’s new product family of direct solder modules based on the OSM standard. He covers, for example, the range of modules available and their possible applications, as well as the ...
We caught up with Analog Devices at Embedded World 2024 as part of our promotional coverage for the event. Fiona Treacy – Managing Director of Industrial Automation at Analog Devices – discusses creating energy-efficient production environments for a more sustainable future. She covers, for example, digitizing, connecting, and interpreting data from the factory floor in real-time and how this unlocks ...
We caught up with NXP in Nuremberg at Embedded World 2024 as part of our promotional coverage for the event. Brian Carlson – Global Marketing Director, Automotive Processors at NXP – discusses the company’s S32 CoreRide platform. He covers, for example, super-integration, and the combination of hardware and software and ecosystems necessary for software-defined vehicles (SDV). Thank you to Brian ...
We caught up with the Winbond team at Embedded World 2024 as part of our promotional coverage for the event. Jun Kawaguchi, Steam Lin and Tetsu Ho – discuss longevity for industrial memory, security for small form factor devices, their Fabs in Taiwan, and Winbond OctalNAND Flash… Jun Kawaguchi covers, for example, the company’s W77Q, a security flash memory with ...
We recently had the opportunity to catch up with Lee Harrison, Director of Product Marketing for Siemens EDA, to talk about Streaming Scan Network (SSN) buses and the next-generation of design-for-test technology. In the interview, for example, he discusses the significant changes involved with SSN, de-coupling complexity and dependencies, and delivering test-pattern content in a packetised format. Watch the interview ...
At the recent Embedded World 2023, which took place in Nuremberg, Electronics Weekly‘s Group Editor, Clive Couldwell caught up with NXP and Microchip. With Brian Carlson – Director of Global Product and Solutions Marketing at NXP – he discussed software-defined vehicles, vehicle architectures and the role of MCUs. And with Ronny Tittoto – Embedded Solution Engineer, Security Function Group, at ...
In a wide-ranging interview, Lee Harrison – Product Marketing Director for Tessent Safety and Security technology – talks about how security is playing a huge part in the development of self-driving cars and key areas of innovation. Particularly, where Siemens Digital Industries Software is focused to meet the needs of the automotive supply chain, both now and in the future. ...
At the recent Embedded World 2023, which took place in Nuremberg, Electronics Weekly‘s Group Editor, Clive Couldwell caught up with MikroE and BrainChip to discuss their technologies in more depth. With Nandan Nayampally – CMO of BrainChip – he discussed neuromorphic computing, how it works and possible applications. And with Neb Matic – CEO of MikroElektronika – they considered remote ...
