Latest Electronics News and Innovations | Electronics Weekly

Microchip’s SAM9X75D5M hybrid MCU SiP targets automotive HMIs

Alun Williams — Wed, 01 Apr 2026 14:14:37 +0000

Microchip’s AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) addresses growing demand for Human-Machine Interfaces (HMIs) in automotive and e-mobility applications. Supporting sophisticated graphics and large display sizes (up to 10 inches ...

The post Microchip’s SAM9X75D5M hybrid MCU SiP targets automotive HMIs appeared first on Electronics Weekly.

EW BrightSparks 2025 profile: Osian Jones, Compound Semiconductor Catapult

Alun Williams — Wed, 01 Apr 2026 09:27:49 +0000

Now in its eighth year, the EW BrightSparks awards see Electronics Weekly celebrate some of the brightest and most talented young engineers in the UK today. In the next in our ...

The post EW BrightSparks 2025 profile: Osian Jones, Compound Semiconductor Catapult appeared first on Electronics Weekly.

2025 Raspberry Pi revenues up 25% YoY

David Manners — Wed, 01 Apr 2026 08:40:35 +0000

Four million Raspberry Pis were shipped in H2 2025, and a total of 7.6 million for FY 2025, up 9% over FY 2024. Revenue was $323 million – up 25% ...

The post 2025 Raspberry Pi revenues up 25% YoY appeared first on Electronics Weekly.

Molex buys Smiths Interconnect

David Manners — Wed, 01 Apr 2026 07:37:57 +0000

Molex has completed the acquisition of Smiths Interconnect, a subsidiary of UK-based Smiths Group. Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedized custom connectors, ...

The post Molex buys Smiths Interconnect appeared first on Electronics Weekly.

Nvidia invests $2bn in Marvell for AI ASIC compatibility

David Manners — Wed, 01 Apr 2026 05:29:07 +0000

Nvidia is to invest $2 billion in Marvell to ensure that Marvell’s customers for datacentre ASICs have a route to compatibility with Nvidia’s computing platform. With the hyperscalers developing their own ...

The post Nvidia invests $2bn in Marvell for AI ASIC compatibility appeared first on Electronics Weekly.

2026 semiconductor capex to increase 20% YoY

David Manners — Wed, 01 Apr 2026 05:27:56 +0000

Semiconductor industry capex was $166 billion in 2025, up 7% YoY, says Semiconductor Intelligence (SI). SI estimates 2026 capex will be $200 billion, up 20% from 2025. TSMC was the ...

The post 2026 semiconductor capex to increase 20% YoY appeared first on Electronics Weekly.

NIST develops high temperature photonics packaging

David Manners — Wed, 01 Apr 2026 05:17:03 +0000

IollNIST (The US National Institute of Science and Technology) scientists have developed a new process for packaging photonic integrated circuits so they can survive and operate in some of the ...

The post NIST develops high temperature photonics packaging appeared first on Electronics Weekly.

Notebook shipments to fall 14.8%

David Manners — Wed, 01 Apr 2026 05:16:33 +0000

Notebook shipments are set to fall 14.8% YoY, says TrendForce. Further price hikes are expected in the coming quarters. A tight memory supply continues to push up system costs, while ...

The post Notebook shipments to fall 14.8% appeared first on Electronics Weekly.

Farnell signs Same Sky

David Manners — Wed, 01 Apr 2026 05:14:46 +0000

Farnell has signed a worldwide distribution agreement with Same Sky, a manufacturer specialising in interconnect, audio, thermal management, motion and control, relay, sensor, and switch solutions. This partnership expands the ...

The post Farnell signs Same Sky appeared first on Electronics Weekly.

ESA awards OHB Sweden the EPS‑Sterna constellation contract

Alun Williams — Tue, 31 Mar 2026 15:31:24 +0000

The European Space Agency (ESA) has selected OHB Sweden to build 20 small satellites for the EUMETSAT Polar System – Sterna (EPS‑Sterna) constellation. EUMETSAT is the European Organisation for the ...

The post ESA awards OHB Sweden the EPS‑Sterna constellation contract appeared first on Electronics Weekly.