The latest news, developments and announcements from around the electronics industry.
Resistors undoubtedly belong to the most basic and essential electronic components. Every modern device contains dozens, sometimes even hundreds of such elements inside. Their task is quite simple – to limit the value of the electric current flowing in the circuit, so that other components can be precisely driven without the risk of damage. SMD Resistors – a wide selection ...
Nordic Semiconductor has updated its Fuel Gauge software to v2.0. This is the battery health system for its nPM1300 and nPM1304 power management ICS. The release adds State-of-Health estimation, adaptive battery modelling, and long-term fleet analytics capabilities, says Nordic. Basically, extending battery management for a wider range of power-constrained IoT products. Fuel Gauge Fuel Gauge v2.0 runs on any host ...
Farnell has signed a new distribution agreement with Hongfa, a leading manufacturer of relays and electromechanical components. The agreement comes as demand for high-performance, reliable relay solutions continues to grow across industrial automation, automotive, energy, and smart building applications. The partnership will introduce high-quality relay and switching technologies to Farnell customers across EMEA, expanding choice and improving availability for design, ...
The European Space Agency has signed Tyvak International to further develop Farinella. This is a 6U CubeSat that will support ESA’s RAMSES planetary defence mission to the near-Earth asteroid Apophis. The passing asteroid apparently offers an opportunity for scientists to observe how Earth’s gravity may affect the structure and behavior of an asteroid. In turn, this will help improve models ...
Micron has begun volume shipment of its HBM4 36GB 12H designed for NVIDIA Vera Rubin and capable of over 11 Gb/s pin speeds, enabling a bandwidth greater than 2.8 TB/s. Micron is also sampling HBM4 48GB 16H which stacks 16 HBM die. “The next era of AI will be defined by tightly integrated platforms developed through joint engineering innovations – ...
NVIDIA today announced the NVIDIA Vera Rubin platform is opening the next frontier of agentic AI, with seven new chips now in full production. They are: the NVIDIA Vera CPU, NVIDIA Rubin GPU, NVIDIA NVLink;6 Switch, NVIDIA ConnectX-9 SuperNIC, NVIDIA BlueField-4 DPU and NVIDIA Spectrum-6 Ethernet switch, as well as the newly NVIDIA Groq 3 LPU. Designed to operate together ...
The government announced today that it is to spend £2bn on quantum computing research over the next four years. The Department of Science, Innovation and Technology (DSIT) says it is encouraging companies to initially build prototype quantum computers with a view to having commercial versions available in the next decade. DSIT is targeting applications in financial services, quantum navigation, energy and pharmaceuticals. ...
The memory shortage could last another four to five years, says the chairman of SK Group, Chey Tae-won. The supply of base wafers is lagging demand by more than 20%, says Chey. “AI actually wants to have a lot of HBM, and once you make the HBM…we have to use a lot of wafers,” said Chey, “So we need some ...
Imec has launched a consortium with 26 European university groups that will work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and chip architecture research. The consortium will benefit from the NanoIC pilot line, turning academic insights into industry-focused innovations. Similar consortia will be set up around advanced materials and alternative compute ...
Following the 14% revenue decline between 2022 and 2024, telecom equipment investment conditions improved in 2025, says Dell’Oro. Telecon equipment revenues across the six programs tracked by Dell’Oro Group—Broadband Access, Microwave & Optical Transport, Mobile Core Network (MCN), Radio Access Network (RAN), and Service Provider Router & Switch—increased 4% year over year (YoY) in 2025, supported by an exceptionally strong ...
