“By collaborating with NVIDIA, we’re helping accelerate the deployment of AI infrastructure that can scale efficiently and reliably,” says TI vp Kannan Soundarapandian.
TI’s architecture requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design.
TI’s approach includes:
● 800V hot-swap controller: Scalable hot-swap solution for input power protection for 800V rails
● 800V to 6V DC/DC bus converter: High density solution featuring integrated GaN power stages, delivering 97.6% peak efficiency with >2000W/in3 power density for compute tray applications
● 6V to <1V multiphase buck converter: High-current solution for advanced GPU cores, with higher power density vs 12V designs and featuring dual-phase power stages.
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