The latest news, developments and announcements from around the electronics industry.
Ericsson and Intel are collaborating for the transition to AI-native 6G deployments and use cases. The collaboration will span mobile connectivity, cloud technologies, and compute capabilities across AI-driven RAN and packet core use cases, and platform level-security and network capabilities. “6G is not merely an iteration of mobile technology. It is the infrastructure that will distribute AI across devices, the ...
Nvidia has hooked up with Booz Allen, BT, Cisco, Deutsche Telekom, Ericsson, MITRE, Nokia, OCUDU Ecosystem Foundation, ODC, SK Telecom, SoftBank and T-Mobile — to build 6G networks on AI-native, open, secure and trustworthy platforms. 6G wireless networks will become the fabric for enabling autonomous machines, vehicles, sensors and robots. By embedding AI across the RAN, edge and core, 6G ...
Semiconductor sales will grow 26% this year to $975bn, says a report from Deloitte’s. AI chips will be responsible for half the revenues while making up 0.2% of the units, says the report. As of mid-December 2025, the combined market cap of the top 10 global chip companies was $9.5tn with the top three chip stocks accounting for 80% of ...
Siemens Digital has brought out an agentic toolkit, which brings agentic AI workflows to its Questa One verification software to accelerate creation, verification planning, execution, debugging and closure. The toolkit aims to move verification and design from isolated tool interactions into intelligent, domain-scoped multi-step, framework-agnostic workflows powered by agentic AI – autonomous systems operating within the verification domain under customer-defined ...
Amphenol RF has added single-crimp N-Type connectors to its interconnect portfolio. These connectors offer the abilityto attach the connectors to cable with only one crimp of the ferrule, eliminating the need to crimp the contact separately. These connectors are IP67-rated when mated and feature a hex nut built into the body for easy mating. Single-crimp N-Type connectors are well-suited for ...
Nordic Semiconductor has brought out a new reference design enabling secure, interoperable access control solutions for commercial and residential applications using Aliro and Matter. The release coincides with the Aliro 1.0 specification. Developed by the Connectivity Standards Alliance (CSA), Aliro replaces physical keys, cards, and fobs with secure mobile credentials that work across reader types, devices, and manufacturers. It supports ...
As the fifth generation to have lived on and worked on her family’s farm in North Dakota, Katie Pinke has seen firsthand the technological evolution that is reshaping the future of agriculture. Manual, time-consuming processes that filled my grandparents’ workdays are now automated and easy to monitor. My 95-year-old grandmother loved the luxury of buying pasteurised milk at the grocery ...
SatVu, the London-based thermal infrared satellite specialist, has raised £30m ($40m) in its latest funding round, lead by the NATO Innovation Fund. This brings its total equity funding to £60m ($80m) as it bids to provide thermal intelligence previously unavailable from commercial sources. For example, it can provide heat signatures associated with activities in buildings. As mentioned, the latest investors ...
Rohm is using its new HPLF5060 package (4.9mm × 6.0mm) to expand its lineup of low-voltage (40V/60V) MOSFETs for automotive applications. For example, main inverter control circuits, electric pumps, and LED headlights. Parts include the AG040FGS4FRA, the AG142FGS4FRA and AG543EGS4FRA, under the company’s EcoMOS brand. HPLF5060 package Rohm highlights the trend for automotive low-voltage MOSFETs moving towards smaller packages. It ...
Qualcomm has announced that Kevin O’Buckley will join the company on 2 March as executive vice-president of global operations and supply chain. O’Buckley is currently senior vice-president and general manager of Intel Foundry Services (IFS) and has previously held leadership roles at IBM, GlobalFoundries and Marvell. At Qualcomm, O’Buckley will lead global semiconductor operations across manufacturing engineering, foundry and supplier ...
