In the first two months of 2026, AI startups have attracted $220 billion, with $189 billion raised in February alone, says a report from BestBrokers.com. This is almost three times the $75.5 billion secured in Q1 2025 and already exceeds the combined $197.8 billion raised across Q1-Q3 2025. If this continues, it is entirely possible that the AI sector could ...
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The latest news, developments and announcements from around the electronics industry.
Imec accelerates DNA data storage
Imec and Atlas Data Storage, a specialist in production-scale DNA data storage, have joined forces to to accelerate the development of digital data storage using synthetic DNA. The collaboration combines Atlas’ ASIC design expertise and scalable DNA synthesis technology with imec’s expertise in advanced chip development, fabrication, and integration. In addition to prototyping and strategic support, imec is investing in ...
Rambus announces HBM4E controller IP
Rambus has launched HBM4E Memory Controller IP. The HBM4E Controller supports operation up to 16 Gbps per pin providing a throughput of 4.1 Terabytes per second (TB/s) to each memory device. For an AI accelerator with eight attached HBM4E devices, this translates to over 32 TB/s of memory bandwidth for next-generation AI workloads. The Rambus HBM4E Controller IP can be ...
Space-Comms Expo: UK gov promises £500m for national space programmes
The UK government will allocate £500m to national space programmes to back high-growth technologies, it said. The investment is to help British companies scale and compete on the international stage. The announcement was made at the two-day Space-Comms Expo event in London, by the UK’s space minister Liz Lloyd. Note that the total is in addition to existing commitments to ...
CMX500 radio communication tester covers all NTN technologies
Rohde & Schwarz’s CMX500 radio communication tester can now cover all non-terrestrial network (NTN) technologies, the company highlights. It also features a Constellation Insight Tool to create a digital twin of the live sky. The one-box tester supports NR-NTN, NB-NTN and Direct-to-Cell (D2C, DTC) technologies. Users can now test all NTN technologies on both network and device level, without the ...
TDK aluminium electrolytic capacitors for DC links in OBCs
TDK is introducing two new DC link capacitor series optimized for on-board chargers (OBCs) in electric vehicles: the ultra compact B43655 and B43656 series. Both series are optimised for forced cooling operation, says the company. It highlights the series support the growing trend toward higher voltages and currents in next-generation OBC platforms. They are available in compact snap-in designs ranging ...
Pickering develops software tool for signal path testing
Test System Architect is a graphical toolset developed for signal path design and deployment by signal switching and simulation specialist, Pickering Interfaces. The toolset is available free of charge and can be used to design, confiture and visualise test architectures, explained Kyle Voosen, product marketing manager at Pickering Interfaces. Voosen said that the challenge faced by many customers today is ...
Counting the cost of war on Iran
The Iran War is hitting the electronics industry, writes Paul Dempsey in Washington DC. Analyst IDC says that if it lasts only a few weeks, it will have a “modest” impact, although inflation across key areas is already visible. But if the conflict drags on, it could worsen component crunches and reignite issues over access to rare earth elements (REEs). ...
Corporate debt nears $60 trillion says OECD report
In 2025, corporate debt increased to an all-time high of about $36 trillion in bonds and $23.1 trillion in syndicated debt for a total of $59.5 trillion, says the OECD Global Debt Report published yesterday. Given the amount of capital expenditure required to finance the expansion of AI, it is expected that corporate debt requirements will continue to increase, says ...
NLM Photonics sampling 1.6T and 3.2T silicon-organic hybrid (SOH) photonic ICs
NLM Photonics of Seattle is sampling its 1.6T and 3.2T silicon-organic hybrid (SOH) photonic integrated circuits (PICs) to select customers. The 1.6T DR8 PIC built with NLM’s patented Selerion-HTX, an organic material, achieves an order-of-magnitude better performance than traditional silicon photonics, claims NLM. The 1.6T and 3.2T PICs were fabricated on Advanced Micro Foundry’s (AMF) 200 mm GP O-band silicon ...
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