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The latest news, developments and announcements from around the electronics industry.

Nvidia sells the last of its stake in Arm

Arm TCS22 GPUs

Nvidia has sold off the last of its stake in Arm. In 2024, Nvidia had 1.96 million Arm shares worth approximately $280 million. In February 2025 Nvidia reduced its holding to 1.1 million shares. In Q4 2025, Nvidia sold off the remaining 1.1 million shares worth about $140 million. In 2020 Nvidia tried to buy Arm for $40 billion. See all ...

Globalfoundries and Renesas hook up for fab

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GlobalFoundries and Renesas have announced an expanded strategic collaboration through a multi‑billion-dollar manufacturing partnership that broadens Renesas’ access to GF technologies. Under this partnership, Renesas will gain further access to GF’s technology portfolio, including FDX (FD-SOI), BCD and feature-rich CMOS technologies with non-volatile memory features to support its SoCs, power devices and MCUs. Tape-outs under this expanded collaboration are on ...

Imec’s record-breaking ADC

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Imec has unveiled a 7‑bit, 175GS/s ADC that combines a record-small footprint (250 x 250µm²) and low conversion energy with one of the fastest sampling speeds ever reported. As such, the ADC meets the rapidly increasing throughput and processing demands of AI- and cloud-driven datacentres, without the area and power explosion typically seen at ultra-high sampling rates. Driven by AI and ...

ams OSRAM’s OSP to become international standard

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OSP, the Open System Protocol developed by ams OSRAM for dynamic lighting and intelligent vehicle networks, is on its way to becoming an international standard. ISO’s Technical Committee TC 22 (Road Vehicles) has launched standardization work on OSP as a new work item within ISO/TC22/SC31/WG3. The official kick-off is planned for February 2026. The work is listed under ISO 26341 ...

Mouser signs ic-Haus

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Mouser  has signed a distribution agreement with iC-Haus – the developer and manufacturer of ASSPs and custom chips. Among ic-Haus products are: The iC-PZ2656  a high-resolution reflective absolute encoder  is a complete lensless optical reflective absolute encoder IC. With its integrated blue LED and interpolator, the iC-PZ2656 provides a high-resolution single-chip absolute linear or rotary encoder solution. Independently configurable BiSS/SSI, ABZ, ...

HBF challenges HBM

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High Bandwidth Flash (HBF) using stacked DRAM and NAND die in the same package is seen as a challenger to High Bandwidth Memory (HBM), particularly for inference. Used with the Blackwell B200, HBF delivered a performance per watt improvement of 2.69-times over HBM, says Hynix. HBF is seen as  well-suited for inference because of the Key-Value (KV) cache used to ...

GM battery cell charges from 10-70% in 5.6 mins

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GM has developed an ultra-fast charge battery cell, the GM XFC Cell, which claims to charge from 10% to 70% in roughly 5.6 minutes, The cell uses a lithium iron phosphate cathode with a silicon-based anode and surface treatments that unlock rapid charging without affecting mechanical durability. The materials and surface treatments  are said to be low-cost and a drop-in ...

Fraunhofer adds 10G TSN IP core

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The Fraunhofer Institute for Photonic Microsystems (IPMS) has developed a 10G TSN endpoint Ethernet IP core, enabling deterministic real-time communication at data rates of up to 10 Gbit/s. The core adds to Fraunhofer’s portfolio of Time-Sensitive Networking (TSN) IP cores. It is designed for demanding applications that require maximum bandwidth, precise time synchronisation and reliable data transmission with exact timing. ...

Infineon and BMW define Neue Klasse platform

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Infineon and BMW have collaborated on BMW’s Neue Klasse SDV architecture incorporated in it automotive electrification platform debuted in the iX3 model (pictured). “We are proud to collaborate with BMW Group to shape the future of mobility,” says Infineon CEO Jochen Hanebeck, “BMW Group’s Neue Klasse marks a significant step in introducing software-defined vehicles to the market and elevates individual ...

High-side driver powers through disturbances

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With 4V minimum operating voltage, ST’s VNQ9050LAJ 4-channel automotive high-side driver powers through disturbances including extreme cold cranking operation down to 2.7V. This resilience when exposed to severe transients meets the latest version of LV124, the automotive industry’s quality standard for electrical and electronic components. Designed to power 12V ground-connected loads, the VNQ9050LAJ is compatible with 3V and 5V logic ...