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The latest news, developments and announcements from around the electronics industry.

Digital twins accelerate auto design

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Siemens’ PAVE360 Automotive digital twin software is designed to address the escalating complexity of automotive hardware and software integration It consists of  off-the-shelf, cloud-based software allowing automakers and suppliers to begin full-system development on day one, reducing setup time from months to days It delivers an integrated, system-level digital twin that speeds up development of ADAS, autonomous driving (AD) and ...

Impulse Embedded supplying Neousys SEMIL-2200GC series

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Impulse Embedded, the Staffordshire  distributor and system integrator for rugged computer systems, is supplying the Neousys SEMIL-2200GC Series computer Powered by Nvidia’s L4 Tensor Core GPU and paired  with Core processors, it is suitable for edge-deployed systems that process large amounts of sensor data locally, enabling faster threat detection, autonomous navigation, and sensor fusion without dependence on remote data centres. ...

IEEE announces student challenge for semiconductor packaging

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A competition launched by the IEEE offers six student teams the chance to attend next year’s Electronic Components and Technology Conference in Orlando, Florida. There are three challenges, each dealing with a critical aspect of simulation and reliability in electronic packaging. The first is for BSc and MSc students: to define a low-cost robust thermal solution for a high power ...

Camera reference design delivers 4K AI inference

Altera camera reference design AI

The 4Kp30 multi-sensor camera reference design is by Altera and designed for its Agilex 5 FPGAs. It uses industry-standard MIPI connectivity: D-PHY and MIPI CSI-2 for the FPGA interface and Altera’s FPGA AI tool for smart camera development to develop glass-to-glass edge vision for smart cameras, with real-time 4K AI interference. The MIPI interface supports up to 2.5Gbps per lane ...

Tata and Rohm to assemble and test power ICs in India

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Rohm and Tata Electronics are to assemble and test Rohm’s India-designed automotive-grade Nch 100V, 300A Si mosfets in a TOLL packaging, with mass production shipments starting next year. The companies will also explore codevelopment of high-value packaging technologies in the future. Both companies will combine efforts to market the products manufactured through this collaboration. ”We are delighted to collaborate with ...

100% reusable rockets could reduce launch cost to $2-5m

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Reusable rockets could reduce the cost of a launch to between $2m and $5m, says TrendForce. At the moment SpaceX can catch the first stage booster containing the main engines, which can be reused, and also recover the two halves of the nose cone, which contain the payload and are floated back down by parachute and reused. The upper stage, ...

Melexis launches 800mA cooling fan driver

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Melexis is introducing the MLX90411-D, an 800mA cooling fan driver that extends the MLX90411 family with enhanced customer configurability, smoother motor control and simplified system integration. Designed for single-coil fans operating from 5V, 12V, 24V or 32V, this innovation targets consumer systems (gaming, PC), home appliances (refrigerators) and power infrastructure (UPS, ESS). Cooling fans are essential in applications ranging from ...

SiC’s correction cycle

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The Power SiC market continues its transformation. Following an unprecedented investment wave between 2019 and 2024, the industry is now entering a correction cycle, says Yole Group. The slowdown in the automotive market has reduced the demand for SiC, transforming the SiC supply chain.  The cycle of falling utilisation rates, excess capacity and reduced investment is raising concerns among industry ...

K-Band upconverter and CATV amplifier

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The QORVO QPC4510 is a K-Band image reject upconverter mixer with integrated x2 LO buffer amplifier and output variable gain amplifier. The QPC4510 outputs an RF frequency from 17.7GHz to 26.5GHz using IF inputs from DC to 4.0 GHz and a corresponding LO frequency. It is designed using QORVO’s pHEMT production process. The QPC4510 typically provides 32dBm of output TOI ...

Q3 datacentre capex up 59% YoY

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Q3 datacentre capex increased 59% YoY marking the eighth consecutive quarter of double-digit growth as the AI investment cycle continues, reports Dell’Oro. “The Top 4 US cloud service providers—Amazon, Google, Meta, and Microsoft—continue to raise datacentre  expectations for 2025, supported by increased investments in both AI and general-purpose infrastructure. Oracle is also on track to double its datacentre  capex this ...