Applications, for example, include video conferencing systems and live broadcasting. Alternatively, interactive gaming, edge computing, robotics, AR/ VR and smart retail systems. With an NPU included, for AI, computing power of up to 80 TOPS is claimed.
“The demand for computing power and multimedia processing capabilities in terminal devices is experiencing explosive growth,” said Doron Zhang, COO of Quectel Wireless Solutions.
“The SP895BD-AP smart module leverages the Dragonwing Q-8750 processor, delivering enhanced performance in CPU, GPU, edge computing and 8K multimedia processing capabilities. It provides a balance between computing power and energy efficiency solution, accelerating the digital and intelligent upgrading of the industry.”
It is available in an LGA package, measuring 33.0 × 39.0 × 3.85mm.
Specification
In terms of its specification, with the Qualcomm CQ8750S CPU there’s an 8-core Qualcomm Oryon processor, clocking up to 2×4.32 GHz + 6×3.53 GHz. The SP895BD-AP module’s GPU is a Qualcomm Adreno 830 GPU. And the NPU (Neural Processing Unit, for accelerating AI) is a Qualcomm Hexagon NPU.
For memory, there is 24GB of LPDDR5X and 256GB UFS 4.0.
With a supply voltage range of 3.55V ~ 4.4V, operating temperatures are between -30°C and +75°C. Operating system support is for Android 15, with further Linux support planned.
Multimedia
For multimedia processing, it can support 8K@30fps video encoding and 8K@60fps decoding. The compnay says this enables low-latency transmission and high-fidelity UHD video restoration for 4K/8K displays or professional conferencing systems
Note, the module features three built-in ISPs (Image Signal Processors) that can process 3 channels of 48MP@30fps video input.
In detail, for imaging, up to six camera interfaces are supported (up to 5 concurrent cameras):
- CSI D-PHY 4-lane, with up to 2.5 Gbps/ lane data rate
- CSI C-PHY 4-lane, with up to 13.68 Gbps/ trio
- 3 × Full ISPs + 2 × Lite ISPs
- 3 × 48 MP @ 30 fps – 3 cameras
- 1 × 108 MP @ 30 fps ZSL – single camera
More information can be found online.
According to the company, when compared with the previous-generation (Series 8) chips, the SP895BD-AP achieves a 45% improvement in CPU performance and a 44% optimisation in energy efficiency.
Image: Quectel
See also: SH602HA-AP computing module targets robotic devices
