Radio Frequency (RF) technologies are vital in the development of wireless communication systems, satellite communications, and wireless networking. Recent innovations in RF components, including amplifiers, filters, and antenna designs, have enabled the deployment of 5G networks, IoT systems, and advanced radar systems. RF technologies are transforming industries such as automotive, consumer electronics, and medical devices, providing faster, more reliable data transmission. As the global demand for connectivity and data services grows, RF advancements continue to play a pivotal role in wireless communication and the future of smart cities and connected ecosystems.
The Siglent SNA5000X-E vector network analyser (VNA) series, designed for RF measurement, is now available from Telonic Instruments. The two models in the SNA5000X-E series can be used for determining the Q factor, bandwidth, and insertion loss of a filter. They feature impedance conversion, movement of measurement plane, fixture simulation, and adapter removal/insertion adjustments. The VNAs have five sweep types ...
At Space-Comms Expo, Filtronic was highlighting the latest version of its Cerus V solid state power amplifier (SSPA) for long range V-Band comms. This is for high-frequency links across land, air and space. One application, for example, is for satellite ground stations, providing a gateway to link to LEO. And other sectors cited by the RF-to-mmWave specialist include defence and ...
Nordic Semiconductor has brought out a new reference design enabling secure, interoperable access control solutions for commercial and residential applications using Aliro and Matter. The release coincides with the Aliro 1.0 specification. Developed by the Connectivity Standards Alliance (CSA), Aliro replaces physical keys, cards, and fobs with secure mobile credentials that work across reader types, devices, and manufacturers. It supports ...
Broadcom has updated its WiFi8 offering with a BCM4918 accelerated processing unit (APU) and two dual-band Wi-Fi 8 devices, the BCM6714 and BCM6719 at CES. Samples of all three chips are available to early access customers and partners. The BCM4918 Wi-Fi 8 APU is designed to unify high-performance computing, networking, and AI acceleration in a single, tightly integrated silicon. Key ...
The 29th European Microwave Week (EuMW 2026) comprises three co-located conferences: EuMIC (European Microwave Integrated Circuits Conference), EuMC (European Microwave Conference) and EuRAD (European Radar Conference) EuMW 2026 includes the Defence, Space, Automotive, and 6G Forum and the opportunity to participate in conferences, workshops, short courses, and special events such as Women in Microwave Engineering, in addition to participating in ...
Novocomms of Birmingham, UK, has £1.5m of Innovate UK funding to develop 28GHz in-antenna switches. “The components we are developing are based on addressable low-loss semiconductors which can be used to switch signals to the elements of an antenna array across a wide range of frequencies,” said Novocomms chairman Colin Tucker. “This addressability reduces the complexity of the PCB on ...
Pickering announced a coaxial RF reed relay with a 4.9 x 4.9mm footprint this week at Productronica. The format, which is through-hole and stands 15.5mm above the PCB, is part of the company’s ‘125’ series, originally launched last year in two-pole single-throw normally-open (‘2 form A) format, aimed at automated test equipment. Equipped with mu metal shielding, the relays can ...
Taoglas, the RF and antenna specialist, has enhanced to its Antenna Integrator tool – part of the company’s AntennaXpert design suite – adding design flexibility and collaboration features. The updates come as the AI in the models learns, adapts and improves from ongoing real-life use cases. The latest Antenna Integrator update adds nine new PCB shape templates – including circle, ...
Fabless companies are benefitting from CHIPs Act funding, with its impact on the talent pipeline, Jim Guzzo of Impinji told Electronics Weekly. Guzzo, the investment in fabs and the development of fab technology is a driver for investment in STEM, science, technology and manufacturing, he said. The fabless, US company develops its own manufacturing processes. This is partly to protect ...
Smiths Interconnect has introduced 50GHz 0404 wire-bondable chip attenuators. HR TSX Wire Bond 2 series are space-qualified to MIL-PRF-55342 and available in 1 to 10dB versions as well as 15dB and 20dB. Up to 1W can be handled. “Built using a robust thin-film technology on an alumina substrate, the HR TSX WB2 Series provides reliable and stable performance in industries such ...
