INCIRT, the Aachen data converter IC specialist, has closed a €4.8 million funding round. Investors were Lifeline Ventures and High Tech Gründerfonds. INCIRT is developing data converters that claim to enable up to 100 times faster data conversion than previous approaches. INCIRT says it has rethought data converters and developed a system architecture that does not focus on optimising existing ...
Data Centres
2025 datacentre capex up 57%
Datacentre capex increased 57% in 2025 as AI deployments, complemented by general infrastructure investments, accelerated, says Dell’Oro, which expects hyperscalers and AI model developers to sustain strong capex momentum in 2026. “The Top 4 US cloud service providers—Amazon, Google, Meta, and Microsoft—increased data center capex by 76 percent in 2025. Oracle more than tripled its data center capex as it ...
$1.7trn 2030 datacentre capex
Datacentre capex will hit $1.7 trillion in 2030, says Dell’Oro. Hyperscale and neo cloud service providers, along with sovereign AI initiatives, are entering a new phase of infrastructure expansion. “The Top 4 US hyperscale cloud service providers—Amazon, Google, Meta, and Microsoft—entered 2026 with strong momentum, raising combined data center capital expenditures to nearly $600 billion,” says Dell’Oro’s Baron Fung, “despite ...
DCPI market to top $80bn in 2030
The Data Centre Physical Infrastructure (DCPI) market is projected to grow at a mid-teens CAGR from 2025 to 2030 to reach more than $80bn, says Dell’Oro. While demand signals remain exceptionally strong, power scarcity has become an increasingly binding constraint on near-term expansion, with on-site generation evolving from a contingency option to a practical necessity for large AI campuses. “The ...
Spending on datacentre switches to exceed $100bn by 2030
Spending on datacentre switches deployed in AI back-end networks is forecast to surpass $100 billion by 2030, driven by expanding deployments across scale-up, scale-out, and scale-across domains, says Dell’Oro. While multiple technologies are expected to coexist and see strong adoption over the forecast period, Ethernet is projected to dominate both the scale-up and scale-out segments of the market. “The next ...
Murata guide to optimising AI datacentre power delivery networks
Murata has launched a technology guide entitled: ‘Optimising Power Delivery Networks for AI Servers in Next-Generation Data Centres.’ The guide introduces specific power delivery network optimisation solutions for AI servers that enhance power stability and reduce power losses across the data center infrastructure. To download it click: Optimising Power Delivery Networks for AI Servers in Next-Generation Data Centres The guide ...
Datacentre liquid cooling market to reach $7bn by 2029
The Data Centre Liquid Cooling market is expected to grow rapidly to about $7 billion in manufacturer revenue by 2029, says Dell’Oro. The expansion reflects liquid cooling’s transition from a niche technology to a foundational requirement for deploying AI infrastructure, as rising accelerator TDP and rack densities push air cooling beyond practical limits. “Liquid cooling has crossed a critical threshold,” ...
Sponsored Content: Data centre boom gets underway in the UK
AI is powering rapid growth in new data centre capacity placing supply chains under pressure to meet demand. Artificial intelligence (AI) is revolutionising all aspects of our lives and society including how we work and how we learn. Recognising their potential to power UK economic growth, the Government has designated data centres as critical national infrastructure (CNI) alongside energy, water ...
Immersions coolant for Open Compute Project
Fuchs Lubricants has designed a coolant fluid for the Open Compute Project single-phase immersion coolant requirement. Called Renolin FECC 10 SYN, it has UL 2417 certification. “We felt it was important to get UL 2417 certified immersion cooling fluid for ICT equipment,” said Fuchs’ development manager Brian Kinkade. “These factors are one less thing for the industry to worry about.” ...
Glass substrates for advanced datacentre packaging
The development of glass-based substrates for electronics in datacentres and high-performance computing is the aim of a consortium gathered by German research institute Fraunhofer IZM (Fraunhofer Institute for reliability and micro-integration). “Due to its material properties, glass offers a promising basis for microelectronics – in particular, its high dimensional stability allows ultra-fine conductor tracks, even below 5μm as structure widths,” ...
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