UMC, Infineon ink MCU fab deal

Infineon and UMC have announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon automotive MCUs.

The MCUs integrate Infineon’s proprietary eNVM technology and will be manufactured at UMC’s Singapore fab on its 40nm process.

“UMC’s shipments of automotive products have tripled since 2019, and we expect this strong momentum to continue as demand for automotive semiconductors rises,” says UMC co-president Jason Wang (pictured)

“At the centre of this partnership is a highly reliable embedded memory solution well suited for enabling next-generation automotive applications while meeting the stringent safety and security requirements for vehicle systems,” says Infineon COO Rutger Wijburg.



 

 

David Manners

David Manners

David Manners has more than forty-years experience writing about the electronics industry, its major trends and leading players. As well as writing business, components and research news, he is the author of the site's most popular blog, Mannerisms. This features series of posts such as Fables, Markets, Shenanigans, and Memory Lanes, across a wide range of topics.

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