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ASML

ASML news focuses on the Dutch tech giant responsible for advanced photolithography systems essential in semiconductor manufacturing. As the exclusive supplier of EUV lithography tools, ASML is pivotal to producing leading-edge chips at 3nm and beyond. Innovations include High-NA EUV machines and precision optics. For Electronics Weekly readers, ASML coverage provides critical insights into the fabrication technologies that underpin modern electronics design, performance scaling, and global chip production capabilities.

ASML 1000W light source to deliver 330wph EUV processing by 2030

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ASML has developed a 1000W light source which should increase the throughput of its high-NA EUV machine from 220wph to 330wph by 2030. The advance has been achieved by doubling the rate at which the molten tin drops in an EUV machine are exposed to a CO₂ laser beam to create plasma that emits EUV radiation. By doubling the droplet ...

ASML sales soar

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ASML has published its 2025 fourth-quarter and full-year results. Q4 total net sales were €9.7bn at a gross margin of 52.2% with net income of €2.8bn Quarterly net bookings in Q4 totalled €13.2bn, of which €7.4bn is EUV and 2025 total net sales were €32.7bn at a gross margin of 52.8% for a net income of €9.6bn. The backlog at ...

Lithography firsts with single-print high-numerical-aperture EUV

Imec 18nm pitch Ru by DME after single-exposure high-NA EUV lithograph

Belgian research lab Imec has revealed advances single-print high numerical aperture EUV lithography at the ‘SPIE Photomask Technology + EUV Lithography’ conference in Monterey California: Line structures at 20nm pitch with 13nm tip-to-tip CD (critical dimension) – relevant for damascene metallisation Electrical test on 20nm pitch ruthenium lines obtained using direct metal etch From the left: 20nm pitch line structures ...

Hynix installs High-NA EUV machine for memory production

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SK Hynix has become the first memory manufacturer to install ASML’s next-generation High-NA Extreme Ultraviolet (EUV) lithography system. The installation of the Twinscan EXE:5200B at its M16 fab in Icheon, South Korea, positions SK Hynix to simplify manufacturing processes and accelerate the development of future DRAM chips for the AI and computing markets. Technical and production impact Resolution and density: ...

Imec and ASML sign five year R&D agreement

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ASML and imec have signed a new strategic partnership agreement, focusing on research and sustainability. The agreement has a duration of five years and aims to deliver valuable solutions in two areas by bringing together ASML’s and imec’s respective knowledge and expertise. First, to develop solutions that advance the semiconductor industry and second, to develop initiatives focused on sustainable innovation. ...