Semiconductor Industry

A competition launched by the IEEE offers six student teams the chance to attend next year’s Electronic Components and Technology Conference in Orlando, Florida. There are three challenges, each dealing with a critical aspect of simulation and reliability in electronic packaging. The first is for BSc and MSc students: to define a low-cost robust thermal solution for a high power ...

The ECTC technical program addresses new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies relevant to electronics packaging. The IEEE’s Electronics ...

The world semiconductor market was $208bn in third-quarter 2025, according to WSTS. This marks the first time the market has been above $200bn, says Semiconductor Intelligence (SI). The 3Q 2025 was up 15.8% from 2Q 2025, the highest quarter-to-quarter growth since 19.9% in 2Q 2009. 3Q 2025 was up 25.1% from 3Q 2024, the highest growth versus a year earlier ...

Spending on 300mm fab equipment is expected to reach $107bn in 2025, according to the 300mmm Fab Outlook report by SEMI. The sector is expected to grow 7% this year and 9% in 2026 to reach $116bn, a 4% increase in 2027 followed by a 15% increase and total worldwide expenditure of $138bn in 2028. Over the next three years, ...

Check out the latest new episode of Electronics Weekly‘s CHIIPS podcast. Our editor, Caroline Hayes, gets together with Dr Andy Sellars and Rupert Baines to pick their brains about the UK’s semiconductor strategy.

Raytheon has been awarded a three-year, two-phase contract from DARPA to develop ultra-wide bandgap semiconductors based on diamond and aluminum nitride. Both of these also have high thermal conductivity – exceptionally high in the case of diamond. The materials will “revolutionise semiconductor electronics with increased power delivery and thermal management in sensors and other electronic applications”, said the company, which ...

Chiba University has found a way to cut blocks of diamond into thin wafers along a difficult but desirable crystal plane using lasers. The ‘100’ plain leaves a surface that is relatively easy to planarise and etch for semiconductor use, according to the Chiba researchers, but diamond wants to crack along its 111 plane, so any crack-based separation starting in ...

I came across a Massachusetts company, THAT Corporation, founded in 1989, that has had its own 4inch foundry in Milpitas California for more than 20 years, making audio semiconductors using a dielectric isolation process. It says: “This four-inch wafer fab gives THAT Corporation the only IC production facility focused primarily on high-performance audio components. While this production fab facility primarily ...

Power module companies Semikron and Danfoss subsidiary Danfoss Silicon Power have completed their merger to form Semikron-Danfossmerge, majority owned by Danfoss. Of the two family-owned companies, Semikron is bringing in 3,000 staff from 24 subsidiaries worldwide, and there will be 500 from Danfoss Silicon Power. Where did Danfoss get resources to buy the significantly larger company? “We can’t go into ...

“More than 50% reduction of the statistical variability compared to bulk mosfets with identical dimensions”, is the claim of Glasgow-based Semiwise for its ‘flat field transistor’, which “is complemented by 30% performance increase and 5% reduction of the manufacturing costs compared to the equivalent bulk CMOS technology transistors.” The company is aiming its flat field transistor (right) at the sense ...