Beyond RF MEMS, dominated by Broadcom and Qorvo, 10 other product categories are choosing piezoelectric thin film deposition technology, including microspeakers, microphones, MEMS oscillators, autofocus and micro-cooling.
Aluminium Nitride (AIN), including Sc-doped AlN, and Lead Zirconate Titanate (PZT) are the principal thin-film deposition materials for transducers, each providing distinct sensing and actuation characteristics.
Beyond RF MEMS, piezoMEMS is emerging as one of the most dynamic segments in the MEMS industry.
This technology is particularly impactful in consumer electronics, where it powers microspeakers, microphones, MEMS autofocus, and several new sensors and actuators currently in development.
While the market slowed in the past two years due to global economic headwinds, it is now set for renewed momentum.
Piezoelectricity has been known for nearly a century, yet only a handful of materials can be effectively scaled to semiconductor processes.
Thin-film PZT, AlN, and Sc-doped AlN each bring distinct properties that define performance for targeted applications.
These material choices are reflected in the wide diversity of products in which thin-film AlN deposition is more applicable to sensing applications, while thin-film PZT contributes mainly to actuating properties.
Several foundries have developed strong expertise in piezoelectric deposition capabilities.
Along with foundries, manufacturers are leveraging partnerships and innovative business models to reduce development timelines, thus accelerating market entry and broadening the adoption of piezoMEMS-based solutions
“In piezoMEMS, we see the convergence of proven materials science and advanced semiconductor manufacturing,” says Yole’s Oleksil Bratash, “this combination explains the rapid proliferation of products and applications, from audio components to next-generation sensing platforms.”
Devices include microspeakers, voice accelerometers, microphones, ultrasonic sensors, and MEMS autofocus for lenses.
MEMS microspeakers from xMEMS (Montara, Cowell) and USound (Achelous, Conamara) are being integrated
into various consumer devices like the Singularity ONI, SoundPEATS Capsule3 Pro+, and Soranik Hearing’s MEMS-3S earbuds.
Voice accelerometers and microphones from Qualcomm (formerly Vesper) integrated into Technics earbuds, Misfit smartwatches, and Arlo cameras.
And ultrasonic and optical devices, including TDK’s CH-101 range sensors and poLight ASA’s TLens autofocus lens, embedded in AR/VR devices such as the Magic Leap 2 and HTC Vive Focus Plus.
Differences in MEMS processes, packaging, ASIC nodes, and structural designs shape performance and costs, enabling manufacturers to differentiate their products in a competitive market.
Using Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray (EDX) techniques, has analysed the piezoelectric layers of each examined device, along with material characteristics, deposition technique, and thickness.
“By comparing piezoMEMS devices across architectures and cost structures, we provide a unique perspective on where innovation truly happens and how value is created in the supply chain,” says Bratash.
MEMS – micro-electromechanical systems
