Home » News » Business » Manufacturing (page 6)

Manufacturing

Thin-film IGZO RFID ICs from Pragmatic shun silicon

PragmatIC NFC connect

Pragmatic Semiconductor, which makes ICs by depositing materials onto flexible plastic substrates, has announced a RFID tag product line for marking retail items. Branded ‘NFC Connect’ it is a passive IC powered and read using near-field communications, conforming “with ISO15693 and NFC Forum Type 5 industry standards, and is easily integrated into existing workflows, providing inlay, assembly and converter partners ...

TSMC 2nm yields nearly ready for mass production

TSMC-Fab-300x200.jpg

TSMC’s 2nm yields are now said to be well above the 60-70% reported by TF International Securities analyst Ming-Chi Kuo in December and headed for mass production this year. It is reported that TSMC could be producing 50,000 2nm wpm by the end of the year. TSMC’s 2nm fabs at Baoshan and Kaohsiung can run 80k wpm at full capacity ...

Imec and ASML sign five year R&D agreement

IMEC-HQ.jpg

ASML and imec have signed a new strategic partnership agreement, focusing on research and sustainability. The agreement has a duration of five years and aims to deliver valuable solutions in two areas by bringing together ASML’s and imec’s respective knowledge and expertise. First, to develop solutions that advance the semiconductor industry and second, to develop initiatives focused on sustainable innovation. ...

Q4 good for advanced foundry nodes; bad for mature nodes

IMG_0466-300x200.webp

Advanced foundry process nodes had 10% q-o-q Q4 growth with demand from AI servers, smartphone processors and PCs driving the top ten foundries to revenues of $38.48 billion. However, mature nodes saw a slowdown in growth . TSMC boosted revenue to $26.85 billion for a 67% market share. Samsung Foundry ranked second, with revenue declining 1.4% QoQ to $3.26 billion, ...

Ams Osram wins Chips Act funding for Austrian manufacturing facility

Ams-Osram-Headquarter-Premstatten-300x200.jpg

Ams Osram has received EU Commission approval for funding to develop a new semiconductor manufacturing facility in Austria. The investment grant – under the European Chips Act – is up to the value of €227 million. The proposed fab, on its Premstätten existing site, will produce next-generation optoelectronic sensors, said the company. In total, the company plans to invest €567 ...

Würth finalises closes Schopfheim PCB factory closure

Wurth closes Schopfheim PCB fab

Würth Elektronik Circuit Board Technology has finalised plans to close its Schopfheim PCB production site in Switzerland, first announced in October. “The management and works council have now reached an agreement on a reconciliation of interests and a social plan, which was presented to the affected employees at a works meeting on Thursday, February 6, 2025,” according to the company. ...

Xaar sells coating technology to Chinese EV battery companies

Xaar CEO John Mills with Omijia

Cambridge-based specialist print head maker Xaar has signed-up two Chinese electric vehicle battery companies for its surface-coating technology. “Our work with Omijia and Shifang highlights Xaar’s commitment to advancing the EV industry by addressing critical challenges in battery manufacturing,” said Xaar CEO John Mills (both photos). Xaar is aiming at replacing traditional coating methods such as PET film with inks ...

Intel’s process tech catch-up looks unlikely

IMG_0623-300x200.webp

Intel’s hopes of overtaking TSMC in process technology this year or next year have taken a knock after a TSMC statement about its A16 process from CEO C.C.Wei that: “Volume production is scheduled for second half 2026.” Meanwhile, rumours are resurrected about a takeover. Intel hopes to start to ramp its 18A process at its Oregon development fab in H2 ...

GloFo to build New York packaging facility

IMG_0621-300x200.jpeg

GlobalFoundries is to create a new centre for advanced packaging and test at its New York fab site which is expected to offer: Advanced packaging, assembly and testing for GF’s differentiated silicon photonics platform, which brings together optical and electrical components on a single chip to realize power efficiencies and performance advantages. Full turnkey advanced packaging, bump, assembly and testing ...

Your own High-NA EUV machine for €208

IMG_0286-300x200.webp

ASML is used to having customers clamouring for its the photography machines during chip booms when supply is tight but sales of its latest offering is being restricted by the company’s own choice. A Lego model (pictured above) of ASML’s $350 million High-NA EUV machine is on sale in the company store for €208. Despite  widespread interest in obtaining a ...