Memory

Micron announced a PCIe Gen5 G9 QLC SSD for client computing. Built on Micron’s G9 NAND, the 3610 NVMe SSD achieves up to 11,000 MB/s sequential read speeds and 9,300 MB/s sequential write speeds. It offers 4TB capacity in a  single-sided M.2 2230 form factor, suitable for ultra-thin laptops and AI-capable devices.. It offers 1.5M IOPS random read and 1.6M ...

The JEDEC Solid State Technology Association says it is nearing completion of a new standard for Standard Package High Bandwidth Memory (SPHBM4). The development addresses the increasing memory requirements of AI data centres. As planned, SPHBM operates at the same aggregate data throughput as HBM4. But it uses fewer pins by operating at a higher frequency. SPHBM4 SPHBM4 devices are ...

Yesterday Micron said it was exiting the Crucial consumer DRAM business, including the sale of Crucial consumer-branded products at key retailers, e-tailers and distributors worldwide. The move comes as DRAM supply is tight while HBM commands 5x the price of a DDR5. Micron will continue Crucial consumer product shipments through the consumer channel until the end of fiscal Q2 (February ...

Last year, the ecsn (Electronic Components Supply Network), the body which represents authorised distributors in the UK and Eire, reported that its members were entering 2025 with “extreme caution”. Customer demand was difficult to judge amid trade issues and high customer in-house inventory levels. Its forecast for 2026 is in a similar vein as global trade issues, such as trade ...

Ferroelectric Memory (FMC) of Dresden has raised €100 million in venture money and subsidies to make FRAM. Backers were the VC funds HV Capital and DeepTech & Climate Fonds in a €77 million equity round and €23 million in subsidies to build prototypes and get them tested and certified. Previous investors include Hynix and the VC arms of Robert Bosch, ...

JEDEC is nearing completion of a standard for low-profile LPDRAM modules developed specifically for data centre AI applications, it reports. It is the JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard. The association says JESD328 is designed to provide a memory platform to deliver modular, low-power, high-bandwidth memory for AI CPU servers. Specifically, the new standard will ...

Teledyne e2v has engineering samples of a 16-GB, radiation-tolerant DDR4 memory. The new chip joins Teledyne e2v’s 4-GB and 8-GB rad-hard DDR4 parts. The new chip is form factor and pin compatible with the prior 4-GB and 8-GB versions. At 16 GB, the new model is the highest density space-grade DDR4 memory on the market, having taken that crown from ...

Teledyne e2v has introduced engineering models of its forthcoming 16Gbyte radiation-tolerant DDR4 memory. “With the release of our engineering model, system architects can begin early validation, preparing for a transition to flight-qualified versions,” said Teledyne marketing manager Thomas Guillemain. The memory measures 15 x 20 x 1.92mm and it pad-compatible with the company’s earlier 4 and 8Gbyte DDR4 ICs which ...

Kioxia has begun sampling 128Gbyte and 256Gbyte and 1Tbyte UFS v4.1 embedded flash memory for automotive applications, with 512Gbyte to follow. “They meet AEC-Q100/104 Grade 2 standards, supporting case temperature up to 115°C,” according to the company. “The UFS 4.1 devices are designed to fit the needs of infotainment, ADAS, telematics, domain controllers and vehicle computers.” Inside is its eight generation ...

Kioxia is shipping samples of 512Gbit triple-level cell flash memory built with its ninth generation 3D technology, with mass production to follow this fiscal year. “The devices are designed to support applications requiring performance and power efficiency in low to mid-level storage capacities. They will also be integrated into Kioxia’s enterprise SSDs, in particular those that aim to maximise GPU ...