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Memory

The latest Electronics Weekly product news on memory technology (such as Flash, MRAM, SSD, NAND, F-RAM, DRAM, etc).

Sponsored Content: Longsys Debuts at MWC25, Unleashing the Power of Storage Innovation in Mobile Communications

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On March 3, Longsys (SZ.301308), a branded semiconductor memory enterprise, made its first-ever appearance at MWC 2025 in Barcelona. Under the theme “New Mode of Storage Empowering Global Mobility”, it showcased a series of innovative storage products, attracting widespread attention. PTM Business Model: Full-Stack Customization Service The Product Technology Manufacturing (PTM) model was a major highlight, showcasing Longsys’ full-stack customization ...

JEDEC updates Universal Flash Storage and Memory Interface standards

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JEDEC – the Solid State Technology Association – is publishing JESD220G: Universal Flash Storage 4.1, an update to the UFS standard. Aimed at applications where power efficiency is essential, UFS 4.1 offers faster data access and improved performance, says the standards body. It also maintains hardware compatibility to UFS 4.0. For example, it will be relevant for mobile applications and ...

Performance gets a reboot with partitioning using Reram

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Embedded NVM such as ReRAM, coupled with smart memory partitioning, can improve the energy efficiency of battery-operated and energy-harvesting ICs, observes Ilan Sever. Low power consumption is a key design consideration, especially for battery-operated IoT devices with Bluetooth Low Energy or energy-harvesting technology, and for medical devices such as wearables and implantables. These devices must ensure that data gathered by ...

Electronica: Video Interview – Datakey on portable memory devices miniaturized for mobile embedded apps

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At Electronica 2024 we caught up with Paul Plitzuweit, Senior Product Manager at Datakey, as part of our promotional coverage for the event. In this interview, he discusses how Datakey Mini-Bar receptacles and memory tokens form a portable memory system that is designed for small embedded systems requiring a robust credential or removable memory device for harsh environments. Designed to ...

Jedec specs JESD230G for improved NAND Flash Interface speeds

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JEDEC, the Solid State Technology Association, has published JESD230G, the NAND Flash Interface Interoperability Standard. The standard introduces speeds of up to 4,800 MT/s, as compared to 400 MT/s in the first version of JESD230, which was published in 2011. JESD230G The standards body highlights that JESD230G also adds a separate Command/Address Bus Protocol (SCA). It improves throughput and efficiency ...

Space-grade NOR flash for FPGA configuration

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Infineon Technologies has introduced a radiation-hardened 512Mbit QSPI NOR flash memory for space applications and other extreme environments. “The device offers a 133MHz quad serial peripheral interface and the highest density, radiation and single-event effects performance available in a QML-qualified non-volatile memory for use with space-grade FPGAs and microprocessors,” claimed the company. To puts some numbers on these radiation claims, ...

Sponsored Content: Longsys Unveils New Products at Electronica Munich, PTM Business Model Drives Innovation in Automotive Storage

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The much-anticipated Electronica Munich has officially opened. At this international event, Longsys (301308.SZ) launched a range of new products alongside its PTM (Product Technology Manufacturing) business model, with a focus on industrial and automotive storage solutions to meet the global demand for intelligent storage across various industries. Global Expansion of Storage Solutions International Debut of the PTM Business Model Longsys ...

JEDEC publishes LP5CAMM2 thin connector standard for SSDs, GPUs

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The JEDEC Solid State Technology Association has announced the PS-007A LPDDR5 CAMM2 Connector Performance Standard, for the “LP5CAMM2” compact form factor. The microelectronics standards body says the connector offers a “standardized modular LPDDR5 solution with ecosystem support”. It contrasts this with the traditional LPDDR5 memory-down approach. Possible applications include solid state drives and GPUs. “Specifically designed for devices that require ...

Kioxia adopts new process for upcoming IPO

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Today, Kioxia is expected to file papers for an IPO on the Tokyo Stock Exchange in the next six months using a new listing process which has not been used before, reports the Nikkei. Kioxia decided not to go ahead with a planned listing in October because market conditions were deemed unfavourable. Under the new IPO process, the company submits ...

Sponsored Content: Storage Empowers an Intelligent World

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Longsys to Debut Dual-Brand Innovations and PTM Business Model at Electronica 2024 in Munich From November 12-15, 2024, Longsys, a branded semiconductor memory enterprise, will be unveiling its latest innovations in memory technology at Electronica in Munich. As an innovative memory solution manufacturer that integrates R&D, design, packaging and testing, manufacturing, and sales services, Longsys has been recognized for its ...