Schott has created high-power TO-9 and SMD packages for laser diodes that have a copper slug that passes all the way through the base. The copper is brazed into position, maintaining overall hermetic sealing. From a thermal simulation that includes a laser, sub-mount and header, the company is claiming a thermal resistance around 8K/W for the TO-9 device (right). “It ...
The 2026 IEEE Electronic Components and Technology Conference (ECTC), the technical conference and exhibition for the semiconductor packaging industry, has announced a Call for Papers. ECTC 2026 will take place May 26-29, 2026 at the Ritz-Carlton Grande Lakes Resort in Orlando, FL. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend. For ...
Cortec has created a packaging film that, certified by USDA, is 100% bio-based, and is compostable in an industrial-grade facility according to TÜV Austria. “Eco Works 100 can decompose alongside organic waste at an industrial composting facility without eco-toxicity to the soil. This harmlessness was demonstrated by growing sunflower seeds in a mixture of 50% blank compost and 50% ...
Toshiba has picked its 4.9 x 6.1 x 1mm ‘SOP Advance(E)’ package for a pair of industrial n-channel mosfets: TPM1R908QM 80V 238A 1.68mΩ max TPM7R10CQ5 150V 120A 7.1mΩ max Maximum junction to case thermal resistance is 0.6°C/W (25°C) in each case. “The SOP Advance(E) package marks a substantial improvement over Toshiba’s existing ‘SOP Advance(N)’ package, reducing package resistance by approximately ...
ChEmpower, a supplier of chemical solutions for wafer planarisation, has raised $18.7 million in Series A funding. The funding will help scale its technology for advanced chip manufacturing and packaging. The funding round was co-led by M Ventures and Rhapsody Venture Partners. New and existing investors Intel Capital, Pangaea Ventures, Foothill Ventures, In-Q-Tel (IQT), and TEL Venture Capital also participated ...
Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly,” according to the company. “Additionally, this leads to improvements in curing time and minimises energy consumption.” FOWLP is a set of wafer-level integration techniques where a wafer ...
Infineon is aiming at automotive power control with a 5 x 7mm top-side cooled surface-mount package, pitching it against the 5 x 6mm bottom-cooled SSO8. The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing ...
Renesas Electronics is part of a consortium building an OSAT (outsourced semiconductor assembly and test) facility at Sanand near Ahmedabad in Gujarat India. It will only hold around 6.8% of the equity capital, with the bulk going to Mumbai engineering conglomerate CG Power and Industrial Solutions. Thailand OSAT provider Stars Microelectronics will hold 0.9%. “CG’s entry into the semiconductor manufacturing ...
NASA, Texas Instruments and others in the space industry have created a qualification standard for using plastic packaged ICs in space: Qualified Manufacturers List Class P – QML Class P. “QML Class P was designed in league with NASA and other industry experts as a plastic packaging standard for space electronic,” TI told Electronics Weekly. The standard is based on ...
Infineon has put 650V mosfet die from its CFD7A portfolio into a surface-mount package with “improved electrical performance over the well-known TO247 through-hole devices, thus enabling efficient energy utilisation in onboard chargers and dc-dc converters”, it said. ‘QDPAK TSC’ is a top-side-cooled package (see images) announced earlier this year and now registered with JEDEC – at the same time it ...
