The company specialises in advanced IC, antenna-in-package (AiP) and system-in-package (SiP) design. Specifically, for next-generation chip technology for space and defence communications.
And it is seeking to strengthen its ties with the UK’s semiconductor and space manufacturing sectors. To this end, it has joined Space South Central, one of the UK’s largest regional space clusters, the organisation has announced.
Circuits Integrated
“Establishing our UK base within the Space South Central cluster is a very exciting moment for the company,” said Carl McMahon, Chief Commercial Officer at Circuits Integrated.
“The region offers a world-class mix of semiconductor expertise, manufacturing capability, and academic strength. By integrating into this ecosystem, we can accelerate the commercialisation of our Kythrion technology and play our part in advancing the UK’s semiconductor and space sectors.”
Compound semiconductor
For its part, the UK Space Agency welcomed the development, highlighting the company’s expertise in compound semiconductor.
Antonia Yendell, Head of Space Ecosystem Development at the UK Space Agency, said:
“We are delighted to welcome Circuits Integrated as the newest member of the Space South Central cluster. Their expertise in compound semiconductor and silicon technologies will further strengthen the UK’s space manufacturing sector, catalyse investment, and create new opportunities throughout the space ecosystem.”
“The support, insight, and partnerships that can be accessed via a local space cluster – supported by the UK Space Agency – represent the best possible landing pad for any international space company looking to establish a presence in the UK.”
Kythrion
As mentioned, Circuits Integrated products include the Kythrion platform. The satcom chipset aims to improve the efficiency of flat-panel antennas and it will be a focus ow work in the UK.
The technology integrates compound (III-V) semiconductors. For example, gallium arsenide (GaAs) or gallium nitride (GaN) with silicon. This is within a 3D system-in-package structure.
According to the company, this can significantly reduce antenna size, weight, power, and cost compared with conventional designs.
The target is a more compact, efficient and robust platform for satellite and defence applications. One capable of supporting future high-throughput communications networks in low-Earth orbit (LEO).
It is currently undergoing packaging and stress validation, with early-stage demonstrators expected in late 2026. General availability will be in mid-2027.
Image: Space South Central – (left to right) Sophia Dilley (UK’s Department for Business and Trade, DBT), Ruth Bretts (DBT) Tobias Marchant (Space South Central), Craig Brown (UK Space Agency), Carl McMahon (Circuits integrated), Paolo Fioravanti (Circuits integrated), Giannis Kontogiannopoulos (Circuits integrated)
See also: UK Space Agency backs Excelerate for multi-beam satellite antenna
