“Mask-less digital lithography machines – which project light materials without a photomask or stencil – are becoming increasingly popular for the manufacturing advanced packaging [that] combines multiple chips and technologies into a single package,” according to the company.
DLP991UUV, as it will be known, has a 1inch diagonal and is TI’s highest resolution direct imaging solution to date, and is the one with the smallest mirror pitch – 5.4μm.
Sub-micron resolution at the surface-to-be-etched is possible as the DMD can handle 22.5W/cm2 illumination when reflecting 405nm ultra-violet radiation.
Bandwidth is 343 to 410nm, across which it has 91% average diffraction efficiency (with f/3 illumination and f/2.4 projection).
Electrically, the array is a two-dimensional array of one-bit CMOS memory cells.
Data enters over 12 HSSI 100Ω differential serial data pairs, and control is over and I2C bus.
Five voltage rails are required: 1.4V (analogue), 1.5V (digital), 10V, -14V and 18V.
Last year, TI introduced a 9 x 9mm controller IC for its 3,840 x 2,160 (UHD) DLP472TP digital micromirror device.
