“With the release of our engineering model, system architects can begin early validation, preparing for a transition to flight-qualified versions,” said Teledyne marketing manager Thomas Guillemain.
The memory measures 15 x 20 x 1.92mm and it pad-compatible with the company’s earlier 4 and 8Gbyte DDR4 ICs which are “already the most deployed in the industry, with hundreds of 4Gbyte and 8Gbyte flight models delivered to date,” it claimed. It will be “compatible with major space-grade processors and FPGAs, including Teledyne’s own LS1046-Space, LX2160-Space, and QLS1046-Space.”
Operation is at up to 2,400Mtransfer/s and flight versions will, said the company, tolerate 100 krad (Si) TID (total ionising dose) and be immune to 60MeV.cm2/mg SEL (single event latch-up). “No-loss data recovery” is also claimed for the IC’s SEU (single event upset) and SEFI (single event functional interrupt) mitigation.
A radiation report is available to customers.
See the engineering model at the 39th Annual Small Satellite Conference next week in Salt Lake City (10 – 13 August, stand 23).
Teledyne e2v also makes image sensors, including some for the ‘biggest camera in the world’.
