- TPM1R908QM 80V 238A 1.68mΩ max
- TPM7R10CQ5 150V 120A 7.1mΩ max
Maximum junction to case thermal resistance is 0.6°C/W (25°C) in each case.
“The SOP Advance(E) package marks a substantial improvement over Toshiba’s existing ‘SOP Advance(N)’ package, reducing package resistance by approximately 65% and thermal resistance by approximately 15%,” according to the company, which compares them to its existing 80V TPH2R408QM and 150V TPH9R00CQ5.
On-resistances above are with the gate at +10V.
Maximum channel temperature is 175°C.
To support circuit design, the company provides a G0 SPICE model for quick circuit function verification, alongside accurate G2 models for reproducing transient characteristics.
Applications are foreseen in industrial switched-mode power supplies.
