Replacing copper in semiconductor packaging with microLED optical links increases data rates and speed while resolving the issues of heat generation encountered by more traditional designs. Singapore’s NSC (New Silicon Corporation) exhibited its latest project at Asia Photonics Expo 2026. Using silicon nitride waveguides and micro LEDs to connect, for example a GPU and high bandwidth memory results in 32Tbps/mm ...
Empower Semiconductor is aiming at high-performance decoupling within IC substrates and interposers with its largest silicon capacitor yet, the 16.6μF EC1005P. “The performance of SoCs and other large computing processors are constantly increasing, said Empower marketing manager Mukund Krishna. “It is becoming increasingly difficult to reach the level of power integrity and voltage regulation that these devices require with conventional ...
French semiconductor research lab has developed a 3D network-on-chip (3D-NoC) for fast computing. It is intended to be used to transfer data between stacked die, or across an array of die on a silicon interposer. “The steady rise in the number of applications that require high-performance computing creates a demand for new hardware-plus-software communications solutions that improve both performance and ...
