Advancements in Process R&D for Electronics Manufacturing | Electronics Weekly https://www.electronicsweekly.com/news/research-news/process-rd/ Thu, 05 Feb 2026 16:16:18 +0000 en-GB hourly 1 https://wordpress.org/?v=6.8.1 https://www.electronicsweekly.com/wp-content/themes/ew/images/logo.gif Electronics Weekly https://www.electronicsweekly.com/news/research-news/process-rd/ 125 75 Singapore shines as photonics centre as Asia Photonics Expo 2026 begins https://www.electronicsweekly.com/news/research-news/process-rd/singapore-shines-as-photonics-centre-as-asia-photonics-expo-2026-begins-2026-02/ https://www.electronicsweekly.com/news/research-news/process-rd/singapore-shines-as-photonics-centre-as-asia-photonics-expo-2026-begins-2026-02/#respond Thu, 05 Feb 2026 14:52:57 +0000 https://www.electronicsweekly.com/?p=888744 The importance of Singapore as a technology hub was reinforced today at the opening of the Asia Photonics Expo (APE) 2026. This year’s APE (4-6 February) is at Sands Expo ...

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IEEE announces student challenge for semiconductor packaging https://www.electronicsweekly.com/news/business/ieee-announces-student-challenge-for-semiconductor-packaging-2025-12/ https://www.electronicsweekly.com/news/business/ieee-announces-student-challenge-for-semiconductor-packaging-2025-12/#respond Tue, 23 Dec 2025 12:19:44 +0000 https://www.electronicsweekly.com/?p=886396 A competition launched by the IEEE offers six student teams the chance to attend next year’s Electronic Components and Technology Conference in Orlando, Florida. There are three challenges, each dealing ...

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HBA lithography tool ‘outstrips electron beam capabilities’ https://www.electronicsweekly.com/news/research-news/process-rd/hba-lithography-tool-outstrips-electron-beam-capabilities-2025-10/ https://www.electronicsweekly.com/news/research-news/process-rd/hba-lithography-tool-outstrips-electron-beam-capabilities-2025-10/#comments Fri, 10 Oct 2025 07:30:06 +0000 https://www.electronicsweekly.com/?p=882119 A hyper-beam array lithography system has been introduced to the US, based on architecture pioneered in Europe. The lithography tool operates with 65,000 independently controlled parallel beams which delivers capabilities ...

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Mentor joins Nano 2022 as France focuses on microelectronics https://www.electronicsweekly.com/news/research-news/mentor-joins-nano-2022-france-focuses-microelectronics-2020-11/ https://www.electronicsweekly.com/news/research-news/mentor-joins-nano-2022-france-focuses-microelectronics-2020-11/#respond Wed, 18 Nov 2020 14:01:39 +0000 https://www.electronicsweekly.com/?p=761446 EDA company, Mentor, has joined Nano 2022, the latest project to promote the French electronics manufacturing industry. It covers components, connectors and PCBs, to design and assembly, distribution, embedded software ...

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Fraunhofer shows flexible OLED printing breakthrough https://www.electronicsweekly.com/news/fraunhofer-shows-flexible-oled-printing-breakthrough-2018-04/ https://www.electronicsweekly.com/news/fraunhofer-shows-flexible-oled-printing-breakthrough-2018-04/#respond Fri, 13 Apr 2018 11:28:32 +0000 https://www.electronicsweekly.com/?p=525371 New inks for inkjet printers make it possible to print organic displays or solar cells on film and glass for the use in architecture, the textile industry and many other ...

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Leti writes ‘unbreakable’ security code on to the chip https://www.electronicsweekly.com/news/leti-writes-unbreakable-security-code-chip-2018-03/ https://www.electronicsweekly.com/news/leti-writes-unbreakable-security-code-chip-2018-03/#respond Thu, 08 Mar 2018 12:37:23 +0000 https://www.electronicsweekly.com/?p=522731 Leti, the French microelectronics research centre, says it has developed a way to encrypt individual chips with a security code. Working with lithography equipment supplier Mapper Lithography, Leti says it ...

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Graphene balls climb the ladder to battery success https://www.electronicsweekly.com/news/research-news/process-rd/graphene-balls-climb-ladder-battery-success-2018-01/ https://www.electronicsweekly.com/news/research-news/process-rd/graphene-balls-climb-ladder-battery-success-2018-01/#respond Thu, 25 Jan 2018 10:40:37 +0000 https://www.electronicsweekly.com/?p=519696 Continuing the industry’s love affair with lithium for batteries, researchers have found a way to avoid dendrites which grow on as the battery charges and discharges and which can degrade ...

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CMOS will cut cost of integrated photonics, says Leti https://www.electronicsweekly.com/news/cmos-will-cut-cost-integrated-photonics-says-leti-2017-12/ https://www.electronicsweekly.com/news/cmos-will-cut-cost-integrated-photonics-says-leti-2017-12/#respond Thu, 07 Dec 2017 10:39:09 +0000 https://www.electronicsweekly.com/?p=515777 French research group Leti has demonstrated a III-V semiconductor fabrication technique which it says will simplify the production of lasers. Leti says it has integrated hybrid III-V silicon lasers on ...

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Glasgow University works with local firms on single photon detectors https://www.electronicsweekly.com/news/glasgow-university-works-local-firms-silicon-photon-detectors-2017-11/ https://www.electronicsweekly.com/news/glasgow-university-works-local-firms-silicon-photon-detectors-2017-11/#respond Wed, 22 Nov 2017 16:09:26 +0000 https://www.electronicsweekly.com/?p=514702 CST Global, the Glasgow-based  III-V opto-electronic, semiconductor foundry, is collaborating with the University of Glasgow and Gas Sensing Solutions on a project to fabricate active matrix, single-photon GaAs devices. The ...

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Leti claims 3D chip breakthrough on 300mm wafers https://www.electronicsweekly.com/news/leti-claims-3d-chip-breakthrough-300mm-wafers-2017-11/ https://www.electronicsweekly.com/news/leti-claims-3d-chip-breakthrough-300mm-wafers-2017-11/#respond Tue, 14 Nov 2017 12:56:01 +0000 https://www.electronicsweekly.com/?p=514273 Leti, an institute of CEA Tech, has announced the world’s first successful 300mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm and copper pads as small ...

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