Looking at only those written in the last week, the most popular stories on our website involve Cadence launching its ChipStack AI Super Agent, silicon wafer shipments in 2025, and Google funding datacentre construction.
Cadence has launched the ChipStack AI Super Agent – agentic AI for front-end silicon design and verification. The Cadence ChipStack AI Super Agent claims to provide up to 10X productivity improvements for coding designs and testbenches, creating test plans, orchestrating regression testing, debugging and automatically fixing issues. “ChipStack represents a major leap in our design-for-AI and AI-for-design strategy, applying agentic ...
The importance of voice AI and immersive audio in home entertainment, automotice infotainement and smartphones has led Cadence to announce its sixth generation of optimised DSP IP, the Tensilicia HiFi iQ DSP, which is purpose-built for on-device voice AI and audio. The latest addition to the HiFi DSP family is based on a purpose-built architecture designed and has double the ...
This week the choices include an ecosystem for pre-validated chiplets, Furiosa AI's Renegade chip, Donut Lab's electric vehicle battery, and a world-first for commercial in-space manufacturing...
Optimised packages of AI models and workflows with API have been packaged as NIMs (Nvidia Inference Microservices) which developers can use as building blocks to develop generative AI for healthcare, from drug discovery, med-tech and digital health products. Nvidia announced 25 NIMs at its developer conference, GTC 2024, offering advanced imaging, natural language and speech recognition, digital biology generation, prediction ...
