64Gbit/s die-to-die interconnect

Marvell Technology is claiming a first with its 2nm 64Gbit/s bi-directional die-to-die interconnect for xPUs.

“Delivering 32Gbit/s of simultaneous two-way connectivity over a single wire, the interface offers bandwidth density over 30Tbit/s/mm, more than three times the bandwidth density of UCIe at equivalent speeds,” it said.

Adaptive power management automatically adjusts for bursty traffic, reducing “interface power consumption by up to 75% with normal workloads and up to 42% during peak traffic periods”, added the company.


Redundant lanes and automatic lane repair are two other features of the interface, and to complete the stack Marvell is offering the application bridge, link layers and physical interconnect.


The technology is also being offered at 3nm.

Steve Bush

Steve Bush is the long-standing technology editor for Electronics Weekly, covering electronics developments for more than 25 years. He has a particular interest in the Power and Embedded areas of the industry. He also writes for the Engineer In Wonderland blog, covering 3D printing, CNC machines and miscellaneous other engineering matters.

Leave a Reply

Your email address will not be published. Required fields are marked *

*