IP block covers Wi-Fi 6, Bluetooth 5.4 dual mode and IEEE 802.15.4 for IoT chips

Ceva has introduced a multi-radio intellectual property package for IoT IC designers that combines Wi-Fi 6, Bluetooth 5.4 and 802.15.4 modems with a 2.4GHz transceiver aimed at TSMC’s 22nm process.

Ceva Links100 block

Called Links100 (diagram right), it is the first of a series of IP products (diagram below) that will also include transceivers for Wi-Fi 7 with MLO (multi-link operation), and UWB (ultra wide-band) with FiRa 2.0, CCC Digital Key 3.0 and radar.

“The demand for smaller devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip,” according to the company.


Wi-Fi 6 in Links100 is a 1×1 40MHz transceiver, and the Bluetooth 5.4 is dual-mode, supporting Classic Audio and LE Audio with Auracast, “and available with a suite of Bluetooth profiles”, said Ceva.


Ceva Links family block

Later products will have Wi-Fi 7 and UWB

IEEE 802.15.4 tranception is provided to implement Thread, Matter and ZigBee, and a co-existence hardware is available to improve concurrent operation of the three transceivers through the single RF path.

Deliverables for the IP series include RTL and C code packages for each wireless protocol – packages which can include sensing and location algorithms for Bluetooth Channel Sounding, Wi-Fi CSI, and UWB radar.

 

Steve Bush

Steve Bush is the long-standing technology editor for Electronics Weekly, covering electronics developments for more than 25 years. He has a particular interest in the Power and Embedded areas of the industry. He also writes for the Engineer In Wonderland blog, covering 3D printing, CNC machines and miscellaneous other engineering matters.

Leave a Reply

Your email address will not be published. Required fields are marked *

*