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Materials R&D

Layers of polymer material build into a battery stack

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The quest for lightweight, compact batteries in power supplies and in electric vehicle is unrelenting, but researchers from the Fraunhofer Institute for Environmental, Safety and Energy Technology UMSICHT in Oberhausen, have developed a flexible and thin bipolar plate material for batteries which do not require sealing, which makes them vulnerable to leakage, and which can be welded to create large ...

Conductive ink breakthrough reduces cost of graphene printed electronics

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Researchers at the University of Manchester have identified dihydrolevogucosenone, a non toxic material which is less expensive than conventional conductive inks. It is a sustainable material that provides higher concentrations and conductivity compared with graphene ink and is lower in cost as it does not rely on metal nanoparticles for electrical conductivity in printed electronics. Printed conductive inks are being developed for transistors, sensors, antennae, ...

University sets up service to tap into the graphene boom

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Aiming to bridge the link between R&D into graphene’s properties and making its application into products on an industrial scale, the National Physical Laboratory (NPL) and the National Graphene Institute (NGI, pictured)  at the University of Manchester, have set up a graphene characterisation service. Graphene is stronger than steel, yet is lightweight and flexible, it is electrically and thermally conductive ...

German researchers show double helix in semiconductors

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This furry caterpillar-like image could represent an important breakthrough in flexible semiconductors for displays and solar cells. It is a semiconductor with a double helix atomic structure, similar to that which is the basis of DNA. 
A team from the Technical University of Munich (TUM) has discovered a double helix structure in an inorganic material. The material comprising tin, iodine ...

3D printed heatsink is worse, then better

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A simple thermal annealing process could make 3D printed heatsinks better than conventional heatsinks, claims the US Oak Ridge National Laboratory. 3D printing, a type of additive manufacturing, makes it possible to produce one-piece exchangers with complex internal structures optimised to efficiently dissipate heat, but the printed material does not conduct heat as well as extruded aluminium, for example. Researcher ...

Intel invests $1.5m in IoT chip R&D in Ireland

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Intel has committed to invest $1.5m over the next three years in research in semiconductor materials, devices and photonics technologies at Tyndall National Institute,  the Irish ICT research institute. Intel has been investing in research at the Cork-based institute since 2009. Bernie Capraro, Research Manager, Silicon Technology at Intel Ireland, said: “The standard of work from Tyndall researchers is top-class, from ...