50GHz wire-bond chip attenuators

Smiths Interconnect has introduced 50GHz 0404 wire-bondable chip attenuators.

Smiths Interconnect HR TSX WB2 chip attenuator

HR TSX Wire Bond 2 series are space-qualified to MIL-PRF-55342 and available in 1 to 10dB versions as well as 15dB and 20dB.

Up to 1W can be handled.


“Built using a robust thin-film technology on an alumina substrate, the HR TSX WB2 Series provides reliable and stable performance in industries such as aerospace, space and defense,” claimed company v-p of RF components Tullio Panarello.


See also: Molex to acquire Smiths Interconnect

Steve Bush

Steve Bush is the long-standing technology editor for Electronics Weekly, covering electronics developments for more than 25 years. He has a particular interest in the Power and Embedded areas of the industry. He also writes for the Engineer In Wonderland blog, covering 3D printing, CNC machines and miscellaneous other engineering matters.

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