It’s aimed at AI servers and data center systems and the company says it combines structural, parametric, high-speed interconnect and functional testing.
The ideal is to allow manufacturers to identify defects earlier in the production process. This would improve yield and quality for high-value AI and data centre hardware.
Omnyx
According to the company, Omnyx incorporates high-speed interconnect and mission-mode/software-directed tests. This is to provide coverage for at-speed and operational defects, typically only detectable at functional test insertions.
“Teradyne Omnyx represents a significant leap forward in PCBA testing, providing our customers with the tools they need to meet the demands of modern AI and data center hardware,” said Mark Kahwati, general manager of the Production Board Test division at Teradyne.
“This platform not only enhances product quality but also accelerates time to market, a critical factor in today’s fast-paced environment. We’re proud to deliver a solution that addresses the complex testing challenges our customers face as our industry innovates new solutions to support advanced AI applications.”
Technical specifications
- Automation: No-touch high-speed conveyance, SMEMA ready
- Test System: Synchronized Analog and Digital Subsystems
- Compatible Test Architecture: Single site, multi-site and large format
- Pin Capacity: 2,560–10,000+ pins
- PCB Footprint: 900x750mm
- PCB Weight: 15kg
- Fixture Compatibility: Automated/manual single-fixture hardware
- Controller: Windows 10/11 Pro PC
- Interface: Integrated mouse/keyboard, monitor
- Networking Interface: Ethernet
