{"id":833470,"date":"2024-01-10T06:06:52","date_gmt":"2024-01-10T06:06:52","guid":{"rendered":"https:\/\/www.electronicsweekly.com\/?p=833470"},"modified":"2024-01-10T06:07:39","modified_gmt":"2024-01-10T06:07:39","slug":"jedec-publishes-new-camm2-memory-module-standard","status":"publish","type":"post","link":"https:\/\/www.electronicsweekly.com\/news\/design\/legislation\/jedec-publishes-new-camm2-memory-module-standard-2024-01\/","title":{"rendered":"JEDEC publishes new CAMM2 memory module standard"},"content":{"rendered":"<p>JEDEC has published a new JESD318 Compression Attached Memory Module (CAMM2) Common Standard, which defines the electrical and mechanical requirements for Compression-Attached Memory Modules.<\/p><div class=\"elect-content\" style=\"margin-left: auto; margin-right: auto; text-align: center; \" id=\"elect-232651592\"><div id=\"x02\">\r\n<script type=\"text\/javascript\"> if ($(window).width() <= 768) { googletag.display('x02'); } <\/script>\r\n<\/div>\r\n<\/div>\n<p><a rel=\"image\" href=\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2024\/01\/09141557\/Samsung-LPCAMM-Module_PR_main1.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-medium wp-image-833471\" src=\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2024\/01\/09141557\/Samsung-LPCAMM-Module_PR_main1-300x169.jpg\" alt=\"JEDEC publishes new CAMM2 memory module standard\" width=\"300\" height=\"169\" srcset=\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2024\/01\/09141557\/Samsung-LPCAMM-Module_PR_main1-300x169.jpg 300w, https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2024\/01\/09141557\/Samsung-LPCAMM-Module_PR_main1-768x432.jpg 768w, https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2024\/01\/09141557\/Samsung-LPCAMM-Module_PR_main1.jpg 1000w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a><\/p>\n<p>It covers both Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LPDDR5\/5X SDRAM CAMM2s).<\/p><div class=\"elect-test\" style=\"margin-left: auto; margin-right: auto; text-align: center; \" id=\"elect-206049648\"><div id=\"DFP-EW-InRead1\">\r\n<script type=\"text\/javascript\"> if ($(window).width() > 768) { googletag.display('DFP-EW-InRead1'); } <\/script>\r\n<\/div>\r\n<BR>\r\n<\/div>\n<p>The standards body highlights that DDR5 and LPDDR5\/5X CAMM2s cater to distinct use cases: DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5\/5X CAMM2s target a broader range of notebooks and certain server market segments.<\/p><div class=\"elect-post-content-2\" style=\"margin-left: auto; margin-right: auto; text-align: center; \" id=\"elect-518437745\"><div id=\"DFP-EW-InRead1-Mobile\">\r\n<script type=\"text\/javascript\"> if ($(window).width() <= 768) { googletag.display('DFP-EW-InRead1-Mobile'); } <\/script>\r\n<\/div>\r\n<\/div>\n<p>While JESD318 CAMM2 defines a common connector design for both DDR5 and LPDDR5\/X, it is crucial to note that the pinouts for each differ, it highlights. To support different motherboard designs, intentional variations in mounting procedures between DDR5 and LPDDR5\/X CAMM2s prevent the mounting of a module where it should not go.<\/p>\n<p>Note that JESD318 CAMM2 supports stackable CAMM2s: dual-channel (DC) and single-channel (SC). By splitting the dual-channel CAMM2 connector lengthwise into two single-channel CAMM2 connectors, each connector half can elevate the CAMM2 to a different level.<\/p>\n<p>JEDEC explains that the first connector half supports one DDR5 memory channel at 2.85mm height while the second half supports a different DDR5 memory channel at 7.5mm height. Or, the entire CAMM2 connector can be used with a dual-channel CAMM2. This scalability from single-channel and dual-channel configurations to future multi-channel setups promises a significant boost in memory capacity, it states.<\/p>\n<p>Version 1.0.2 of the standard was officially published in November 2023.<\/p>\n<blockquote><p>&#8220;The development of JEDEC CAMM2 exemplifies JEDEC\u2019s commitment to serving the industry with innovative standards,&#8221; <a rel=\"image\" href=\"https:\/\/www.jedec.org\/news\/pressreleases\/jedec-publishes-new-camm2-memory-module-standard\" target=\"_blank\" rel=\"nofollow noopener\">said<\/a> Mian Quddus, the organisation\u2019s Board of Directors Chairman. &#8220;CAMM2 is versatile across various use cases and is designed with future scalability in mind.&#8221;<\/p><\/blockquote>\n<p>Tom Schnell, JEDEC\u2019s CAMM Task Group Chairman added:<\/p>\n<blockquote><p>&#8220;JEDEC CAMM2 is positioned to support and drive next-generation products, offering designers an extensive range of modularity options.&#8221;<\/p>\n<p>&#8220;As technology evolves, memory requirements grow, and JEDEC CAMM2 is at the forefront of addressing these demands. The support for future multi-channel configurations ensures that designers and manufacturers are not just meeting current needs but are also well-prepared for the evolving landscape of memory solutions.&#8221;<\/p><\/blockquote>\n<p>JESD318 CAMM2 is available for download from the JEDEC website.<\/p>\n<p>The standard was the work of committee JC-45, which develops standards for DRAM modules, cards, and socket interfaces &#8211; addressing &#8220;architectural, electrical, test, and SPD issues relating to memory design and manufacturing for commercial applications&#8221;.<\/p>\n<p><em>Image: Samsung&#8217;s Low Power Compression Attached Memory Module (<a rel=\"image\" href=\"https:\/\/news.samsung.com\/global\/samsung-electronics-industry-first-lpcamm-ushers-in-future-of-memory-modules\" target=\"_blank\" rel=\"nofollow noopener\">LPCAMM<\/a>)<\/em><\/p>\n<p><em>See also<\/em>: <a rel=\"image\" href=\"https:\/\/www.electronicsweekly.com\/news\/products\/discretes\/jedec-adopts-top-side-cooled-surface-mount-power-package-2023-02\/\">JEDEC adopts top-side-cooled surface-mount power package<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>JEDEC has published a new JESD318 Compression Attached Memory Module (CAMM2) Common Standard, which defines the electrical and mechanical requirements for Compression-Attached Memory Modules. It covers both Double Data Rate, &#8230;<\/p>\n","protected":false},"author":4274,"featured_media":833471,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[12655],"tags":[13677,13584],"class_list":["post-833470","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-legislation","tag-ddr","tag-dram"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.7 (Yoast SEO v27.2) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>JEDEC publishes new CAMM2 memory module standard | Electronics Weekly<\/title>\n<meta name=\"description\" content=\"JEDEC has published a new JESD318 Compression Attached Memory Module (CAMM2) Common Standard, which defines the electrical and mechanical requirements for\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.electronicsweekly.com\/news\/design\/legislation\/jedec-publishes-new-camm2-memory-module-standard-2024-01\/\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:title\" content=\"JEDEC publishes new CAMM2 memory module standard | Electronics Weekly\" \/>\n<meta name=\"twitter:description\" content=\"JEDEC has published a new JESD318 Compression Attached Memory Module (CAMM2) Common Standard, which defines the electrical and mechanical requirements for\" \/>\n<meta name=\"twitter:image\" content=\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2024\/01\/09141557\/Samsung-LPCAMM-Module_PR_main1.jpg\" \/>\n<meta name=\"twitter:creator\" content=\"@ElectronicsNews\" \/>\n<meta name=\"twitter:site\" content=\"@ElectronicsNews\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Alun Williams\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/legislation\/jedec-publishes-new-camm2-memory-module-standard-2024-01\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/legislation\/jedec-publishes-new-camm2-memory-module-standard-2024-01\/\"},\"author\":{\"name\":\"Alun Williams\",\"@id\":\"https:\/\/www.electronicsweekly.com\/#\/schema\/person\/eadb9935cd487ae059d0bc1cfc7a2de9\"},\"headline\":\"JEDEC publishes new CAMM2 memory module standard\",\"datePublished\":\"2024-01-10T06:06:52+00:00\",\"dateModified\":\"2024-01-10T06:07:39+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/legislation\/jedec-publishes-new-camm2-memory-module-standard-2024-01\/\"},\"wordCount\":440,\"commentCount\":0,\"image\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/legislation\/jedec-publishes-new-camm2-memory-module-standard-2024-01\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2024\/01\/09141557\/Samsung-LPCAMM-Module_PR_main1.jpg\",\"keywords\":[\"DDR\",\"DRAM\"],\"articleSection\":[\"Legislation &amp; 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