{"id":885025,"date":"2025-11-27T15:40:31","date_gmt":"2025-11-27T15:40:31","guid":{"rendered":"https:\/\/www.electronicsweekly.com\/?p=885025"},"modified":"2025-11-28T14:00:04","modified_gmt":"2025-11-28T14:00:04","slug":"uk-mems-multi-project-wafer-pipeline","status":"publish","type":"post","link":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/","title":{"rendered":"UK MEMS multi-project wafer pipeline"},"content":{"rendered":"<p><a rel=\"image\" href=\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp\"><img loading=\"lazy\" decoding=\"async\" class=\"alignright size-medium wp-image-885026\" src=\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web-300x212.webp\" alt=\"UofSouthampton Microcraft\" width=\"300\" height=\"212\" srcset=\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web-300x212.webp 300w, https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp 626w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a>The UK is to get a MEMS multi-project wafer pipeline as the University of Southampton&#8217;s nascent Microcraft MEMS fab partners with Siemens\u2019 Cre8Ventures EDA tool access programme.<\/p><div class=\"elect-content\" style=\"margin-left: auto; margin-right: auto; text-align: center; \" id=\"elect-430057732\"><div id=\"x02\">\r\n<script type=\"text\/javascript\"> if ($(window).width() <= 768) { googletag.display('x02'); } <\/script>\r\n<\/div>\r\n<\/div>\n<p>&#8220;The collaboration between Microcraft and Siemens Cre8Ventures is application-focused to deliver design-simulation-fabrication capability across UK and Europe,&#8221; Southampton associate director of business development Ibrahim Sari told Electronics Weekly.<\/p>\n<p>It is aimed broadly at students, researchers, start-ups and established companies.<\/p><div class=\"elect-post-content-2\" style=\"margin-left: auto; margin-right: auto; text-align: center; \" id=\"elect-2147434807\"><div id=\"DFP-EW-InRead1-Mobile\">\r\n<script type=\"text\/javascript\"> if ($(window).width() <= 768) { googletag.display('DFP-EW-InRead1-Mobile'); } <\/script>\r\n<\/div>\r\n<\/div><div class=\"elect-test\" style=\"margin-left: auto; margin-right: auto; text-align: center; \" id=\"elect-277786296\"><div id=\"DFP-EW-InRead1\">\r\n<script type=\"text\/javascript\"> if ($(window).width() > 768) { googletag.display('DFP-EW-InRead1'); } <\/script>\r\n<\/div>\r\n<BR>\r\n<\/div>\n<p>The Siemens contribution, Cre8Ventures, is a way for entities to check designs using cloud-based EDA tool flows and digital-twin facilities.<\/p>\n<p>It &#8220;allows them to simulate and validate power and performance claims without the costs of physical production&#8221;, said Siemens. &#8220;Furthermore, Cre8Ventures assists with proof-of-technology, proof-of-concept, and proof-of-value stages.&#8221;<\/p>\n<p>Southampton University has its own wafer fab, with equipment capable of prototyping multiple semiconductor technologies.<\/p>\n<p>This fab is already used by the university&#8217;s academic &#8216;Southampton Nanofabrication Centre&#8217;, as well as the university&#8217;s commercial opto-electronic spin-out Cornerstone, which handles prototyping for academic teams and companies across the world, as well as limited production runs.<\/p>\n<p>Announced recently, Microcraft is intended to be a MEMS version of Cornerstone, also using Southampton&#8217;s fab.<\/p>\n<p>&#8220;Technically Microcraft is operational and providing custom fabrication services,&#8221; said Southampton&#8217;s Sari. &#8220;With future funding &#8211; which we expect to hear about soon &#8211; we aim to streamline our operations through a multi-project wafer fabrication platform.&#8221;<\/p>\n<p>What is Microcraft intended to make?<\/p>\n<p>&#8220;Inertial sensors, biomedical devices, microfluidics and components for quantum devices as well as enable advanced packaging,&#8221; said Sari. It will also offer &#8220;heterogenous integration, design support and hands-on skills training&#8221;.<\/p>\n<p>The Siemens connection builds upon Microcraft capability.<\/p>\n<p>&#8220;By validating complex MEMS and NEMS designs in our virtual environment before they are fabricated by Microcraft, we can help innovators save time and capital,&#8221; claimed Cre8Ventures co-founder Carson Bradbury. &#8220;Together, we are de-risking innovation.&#8221;<\/p>\n<p>Earlier this year, in August, <a rel=\"image\" href=\"https:\/\/www.electronicsweekly.com\/news\/business\/siemens-arm-and-southampton-uni-announce-cre8ventures-open-higher-education-program-2025-08\/\">a similar, smaller, programme was announced<\/a>\u00a0&#8211; &#8220;Southampton joined Siemens and Arm to launch &#8216;Cre8Ventures Open Higher Education&#8217; programme, which is an education focused activity&#8221;, explained Sari.<\/p>\n<p>Image: Researcher working in the Zepler Cleanrooms, which houses the University of Southampton&#8217;s wafer fab.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The UK is to get a MEMS multi-project wafer pipeline as the University of Southampton&#8217;s nascent Microcraft MEMS fab partners with Siemens\u2019 Cre8Ventures EDA tool access programme. &#8220;The collaboration between &#8230;<\/p>\n","protected":false},"author":2,"featured_media":885026,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[12690,12663],"tags":[],"class_list":["post-885025","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-design","category-manufacturing"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.7 (Yoast SEO v27.2) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>UK MEMS multi-project wafer pipeline | Electronics Weekly<\/title>\n<meta name=\"description\" content=\"The UK is to get a MEMS 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pipeline\",\"datePublished\":\"2025-11-27T15:40:31+00:00\",\"dateModified\":\"2025-11-28T14:00:04+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/\"},\"wordCount\":355,\"commentCount\":0,\"image\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp\",\"articleSection\":[\"Design\",\"Manufacturing\"],\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/\",\"url\":\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/\",\"name\":\"UK MEMS multi-project wafer pipeline | Electronics Weekly\",\"isPartOf\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp\",\"datePublished\":\"2025-11-27T15:40:31+00:00\",\"dateModified\":\"2025-11-28T14:00:04+00:00\",\"author\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/#\/schema\/person\/6b872697fe5e17abda1e967b9d09c1bd\"},\"description\":\"The UK is to get a MEMS multi-project wafer pipeline as the University of Southampton's nascent Microcraft MEMS fab partners with Siemens\u2019 Cre8Ventures\",\"breadcrumb\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#breadcrumb\"},\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#primaryimage\",\"url\":\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp\",\"contentUrl\":\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp\",\"width\":626,\"height\":442,\"caption\":\"U of Southampton Microcraft mems fab\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.electronicsweekly.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"UK MEMS multi-project wafer pipeline\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.electronicsweekly.com\/#website\",\"url\":\"https:\/\/www.electronicsweekly.com\/\",\"name\":\"Electronics Weekly\",\"description\":\"\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.electronicsweekly.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-GB\"},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.electronicsweekly.com\/#\/schema\/person\/6b872697fe5e17abda1e967b9d09c1bd\",\"name\":\"Steve Bush\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\/\/secure.gravatar.com\/avatar\/c9265551aa9558e0529386854909c9e29fa812e6589d3c18b0e0ca30dff9397a?s=96&d=mm&r=g\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/c9265551aa9558e0529386854909c9e29fa812e6589d3c18b0e0ca30dff9397a?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/c9265551aa9558e0529386854909c9e29fa812e6589d3c18b0e0ca30dff9397a?s=96&d=mm&r=g\",\"caption\":\"Steve Bush\"},\"description\":\"Steve Bush is the long-standing technology editor for Electronics Weekly, covering electronics developments for more than 25 years. He has a particular interest in the Power and Embedded areas of the industry. He also writes for the Engineer In Wonderland blog, covering 3D printing, CNC machines and miscellaneous other engineering matters.\",\"url\":\"https:\/\/www.electronicsweekly.com\/author\/steve-bush\/\"}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"UK MEMS multi-project wafer pipeline | Electronics Weekly","description":"The UK is to get a MEMS multi-project wafer pipeline as the University of Southampton's nascent Microcraft MEMS fab partners with Siemens\u2019 Cre8Ventures","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/","twitter_card":"summary_large_image","twitter_title":"UK MEMS multi-project wafer pipeline | Electronics Weekly","twitter_description":"The UK is to get a MEMS multi-project wafer pipeline as the University of Southampton's nascent Microcraft MEMS fab partners with Siemens\u2019 Cre8Ventures","twitter_image":"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp","twitter_creator":"@ElectronicsNews","twitter_site":"@ElectronicsNews","twitter_misc":{"Written by":"Steve Bush","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#article","isPartOf":{"@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/"},"author":{"name":"Steve Bush","@id":"https:\/\/www.electronicsweekly.com\/#\/schema\/person\/6b872697fe5e17abda1e967b9d09c1bd"},"headline":"UK MEMS multi-project wafer pipeline","datePublished":"2025-11-27T15:40:31+00:00","dateModified":"2025-11-28T14:00:04+00:00","mainEntityOfPage":{"@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/"},"wordCount":355,"commentCount":0,"image":{"@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#primaryimage"},"thumbnailUrl":"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp","articleSection":["Design","Manufacturing"],"inLanguage":"en-GB","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/","url":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/","name":"UK MEMS multi-project wafer pipeline | Electronics Weekly","isPartOf":{"@id":"https:\/\/www.electronicsweekly.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#primaryimage"},"image":{"@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#primaryimage"},"thumbnailUrl":"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp","datePublished":"2025-11-27T15:40:31+00:00","dateModified":"2025-11-28T14:00:04+00:00","author":{"@id":"https:\/\/www.electronicsweekly.com\/#\/schema\/person\/6b872697fe5e17abda1e967b9d09c1bd"},"description":"The UK is to get a MEMS multi-project wafer pipeline as the University of Southampton's nascent Microcraft MEMS fab partners with Siemens\u2019 Cre8Ventures","breadcrumb":{"@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#breadcrumb"},"inLanguage":"en-GB","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/"]}]},{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#primaryimage","url":"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp","contentUrl":"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2025\/11\/27142637\/UofSouthampton-Microcraft-web.webp","width":626,"height":442,"caption":"U of Southampton Microcraft mems fab"},{"@type":"BreadcrumbList","@id":"https:\/\/www.electronicsweekly.com\/news\/design\/uk-mems-multi-project-wafer-pipeline-2025-11\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.electronicsweekly.com\/"},{"@type":"ListItem","position":2,"name":"UK MEMS multi-project wafer pipeline"}]},{"@type":"WebSite","@id":"https:\/\/www.electronicsweekly.com\/#website","url":"https:\/\/www.electronicsweekly.com\/","name":"Electronics Weekly","description":"","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.electronicsweekly.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-GB"},{"@type":"Person","@id":"https:\/\/www.electronicsweekly.com\/#\/schema\/person\/6b872697fe5e17abda1e967b9d09c1bd","name":"Steve Bush","image":{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/secure.gravatar.com\/avatar\/c9265551aa9558e0529386854909c9e29fa812e6589d3c18b0e0ca30dff9397a?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/c9265551aa9558e0529386854909c9e29fa812e6589d3c18b0e0ca30dff9397a?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/c9265551aa9558e0529386854909c9e29fa812e6589d3c18b0e0ca30dff9397a?s=96&d=mm&r=g","caption":"Steve Bush"},"description":"Steve Bush is the long-standing technology editor for Electronics Weekly, covering electronics developments for more than 25 years. He has a particular interest in the Power and Embedded areas of the industry. He also writes for the Engineer In Wonderland blog, covering 3D printing, CNC machines and miscellaneous other engineering matters.","url":"https:\/\/www.electronicsweekly.com\/author\/steve-bush\/"}]}},"_links":{"self":[{"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/posts\/885025","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/comments?post=885025"}],"version-history":[{"count":3,"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/posts\/885025\/revisions"}],"predecessor-version":[{"id":885113,"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/posts\/885025\/revisions\/885113"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/media\/885026"}],"wp:attachment":[{"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/media?parent=885025"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/categories?post=885025"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.electronicsweekly.com\/wp-json\/wp\/v2\/tags?post=885025"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}