{"id":888813,"date":"2026-02-06T09:44:05","date_gmt":"2026-02-06T09:44:05","guid":{"rendered":"https:\/\/www.electronicsweekly.com\/?p=888813"},"modified":"2026-02-07T04:00:43","modified_gmt":"2026-02-07T04:00:43","slug":"singapore-lab-replaces-interposer-copper-with-optical-fibre","status":"publish","type":"post","link":"https:\/\/www.electronicsweekly.com\/news\/business\/singapore-lab-replaces-interposer-copper-with-optical-fibre-2026-02\/","title":{"rendered":"Singapore lab replaces interposer copper with micro LEDs"},"content":{"rendered":"<p>Replacing copper in semiconductor packaging with microLED optical links increases data rates and speed while resolving the issues of heat generation encountered by more traditional designs.<\/p><div class=\"elect-content\" style=\"margin-left: auto; margin-right: auto; text-align: center; \" id=\"elect-752817612\"><div id=\"x02\">\r\n<script type=\"text\/javascript\"> if ($(window).width() <= 768) { googletag.display('x02'); } <\/script>\r\n<\/div>\r\n<\/div>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-medium wp-image-888816\" src=\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2026\/02\/06091848\/NSC-revised-300x171.webp\" alt=\"nsc Innovation labs photonics interposer\" width=\"300\" height=\"171\" srcset=\"https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2026\/02\/06091848\/NSC-revised-300x171.webp 300w, https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2026\/02\/06091848\/NSC-revised-768x437.webp 768w, https:\/\/static.electronicsweekly.com\/wp-content\/uploads\/2026\/02\/06091848\/NSC-revised.webp 1024w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/p>\n<p>Singapore\u2019s NSC (New Silicon Corporation) exhibited its latest project at <a rel=\"image\" href=\"http:\/\/www.asiaphotonicsexpo.com\" target=\"_blank\" rel=\"nofollow\">Asia Photonics Expo 2026<\/a>. Using silicon nitride waveguides and micro LEDs to connect, for example a GPU and high bandwidth memory results in 32Tbps\/mm operation, compared to ~1.5Tbps\/mm using copper, explained Niu Jing, a scientist at <a rel=\"image\" href=\"http:\/\/www.nscinnovation.com\" target=\"_blank\" rel=\"nofollow\">NSC<\/a>.<\/p><div class=\"elect-test\" style=\"margin-left: auto; margin-right: auto; text-align: center; \" id=\"elect-225618053\"><div id=\"DFP-EW-InRead1\">\r\n<script type=\"text\/javascript\"> if ($(window).width() > 768) { googletag.display('DFP-EW-InRead1'); } <\/script>\r\n<\/div>\r\n<BR>\r\n<\/div>\n<p>There is no fibre alignment or lasers needed as the light is self-contained in the chip itself. Another advantage is that equivalent copper traces on existing interposers require greater power and therefore cause additional heating.<\/p><div class=\"elect-post-content-2\" style=\"margin-left: auto; margin-right: auto; text-align: center; \" id=\"elect-202866280\"><div id=\"DFP-EW-InRead1-Mobile\">\r\n<script type=\"text\/javascript\"> if ($(window).width() <= 768) { googletag.display('DFP-EW-InRead1-Mobile'); } <\/script>\r\n<\/div>\r\n<\/div>\n<p>The research lab is working with commercial foundries such as Tower Semiconductor and the first tapeout is expected in the middle of this year.<\/p>\n<p>NSC spun out from a research group within MIT\u2019s research enterprise, the Singapore-MIT Alliance for Research and Technology (SMART) which conducted research into semiconductor and materials integration for the Low Energy Electronic Systems (LEES) research group. It describes itself as a \u201cplayground of creativity and a laboratory for exploration\u201d. It encourages collaboration for chip design for innovation in extended reality, mobility, smart lighting, telecommunications and wearables.<\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"1PP9rDTak8\"><p><a rel=\"image\" href=\"https:\/\/www.electronicsweekly.com\/news\/products\/eye-tracking-ai-glasses-for-cyclists-2026-02\/\">Eye tracking AI glasses for cyclists<\/a><\/p><\/blockquote>\n<p><iframe loading=\"lazy\" class=\"wp-embedded-content\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; visibility: hidden;\" title=\"&#8220;Eye tracking AI glasses for cyclists&#8221; &#8212; Electronics Weekly\" src=\"https:\/\/www.electronicsweekly.com\/news\/products\/eye-tracking-ai-glasses-for-cyclists-2026-02\/embed\/#?secret=qGt4tcHYxq#?secret=1PP9rDTak8\" data-secret=\"1PP9rDTak8\" width=\"600\" height=\"338\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\"><\/iframe><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Replacing copper in semiconductor packaging with microLED optical links increases data rates and speed while resolving the issues of heat generation encountered by more traditional designs. Singapore\u2019s NSC (New Silicon &#8230;<\/p>\n","protected":false},"author":7791,"featured_media":888816,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[17258,16039,12649,12659,12640],"tags":[17428,13222,16699,14023],"class_list":["post-888813","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-ai","category-business","category-communications","category-device-rd","category-news","tag-asia-photonics-expo","tag-copper","tag-interposer","tag-optical-fibre","interest-business","interest-communications","interest-microprocessors","interest-research"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.7 (Yoast SEO v27.2) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>Singapore lab replaces interposer copper with micro LEDs | Electronics Weekly<\/title>\n<meta name=\"description\" content=\"Replacing copper in 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content=\"@ElectronicsNews\" \/>\n<meta name=\"twitter:site\" content=\"@ElectronicsNews\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Caroline Hayes\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/business\/singapore-lab-replaces-interposer-copper-with-optical-fibre-2026-02\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.electronicsweekly.com\/news\/business\/singapore-lab-replaces-interposer-copper-with-optical-fibre-2026-02\/\"},\"author\":{\"name\":\"Caroline Hayes\",\"@id\":\"https:\/\/www.electronicsweekly.com\/#\/schema\/person\/6c8b9fd4ec1977990420c31d5b6c669b\"},\"headline\":\"Singapore lab replaces interposer copper with micro 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