TSMC is looking at the possibility of building six fabs in the UAE, reports Bloomberg. Last September the Wall Street Journal reported that both TSMC and Samsung had visited the UAE to talk about building fabs there. Talks with the Biden administration about the plan broke down when the US government said it would need assurances that the US would ...
Siemens Digital Industries Software and Intel Foundry have announced tool certifications. Siemens’ Calibre nmPlatform tool is now certified for the Intel 18A PDK. Siemens’ Solido SPICE and Analog FastSPICE (AFS) software tools have been certified for the Intel 18A PDK. Siemens’ Calibre nmPlatform and its Analog FastSPICE (AFS) software, which is part of Siemens’ Solido Simulation Suite offerings, are also ...
Hybrid bonding offers advantages over ‘bump-based’ interconnects, but high yield production relies on inspection. By Hari Polu. Hybrid bonding is quickly gaining recognition due to the enhanced reliability and mechanical strength of its interconnects, as well as the space savings compared to traditional bump-based interconnections. This bonding technique vertically links die-to-wafer or wafer-to-wafer via closely spaced copper pads, bonding the ...
ChEmpower, a supplier of chemical solutions for wafer planarisation, has raised $18.7 million in Series A funding. The funding will help scale its technology for advanced chip manufacturing and packaging. The funding round was co-led by M Ventures and Rhapsody Venture Partners. New and existing investors Intel Capital, Pangaea Ventures, Foothill Ventures, In-Q-Tel (IQT), and TEL Venture Capital also participated ...
Yesterday, TSMC unveiled its next cutting-edge logic process technology, A14, at the company’s North America Technology Symposium. Representing a significant advancement from TSMC’s industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of ...
The UK government has demonstrated an anti-drone radio frequency directed energy weapon. “It uses high frequency radio waves to disrupt or damage critical electronic components inside drones, causing them to crash or malfunction,” according to the government, which tested the weapon in West Wales. The “systems can defeat airborne targets at ranges of up to 1km and are effective against ...
Kyocera is now offering the production technology “Ceramic Additive Manufacturing” for customers in Europe. Using this method, it is possible to manufacture products with complex geometries and almost any type of customized shape. In addition, prototypes can be created very quickly, allowing production volumes of thousands of units per week to be reached in a short period of time. Kyocera’s ...
Nvidia is working with its manufacturing partners to design and build factories that, for the first time, will produce Nvidia AI supercomputers entirely in the U.S. Together with leading manufacturing partners, the company has commissioned more than a million square feet of manufacturing space to build and test NVIDIA Blackwell chips in Arizona and AI supercomputers in Texas. Nvidia Blackwell ...
Power mosfet and wafer-maker IceMos Technology has pulled-in $22m of series-E funding, including $7.5m from 57 Stars, and money from un-named “earlier stage USA investors” and a “London-based investor”, said IceMos Headquartered in Arizona, IceMos has manufacturing in Northern Ireland, research in Arizona and a design center in Tokyo. Its wafer products include active layers attached to handle wafers using ...
The IPC, the industry association for printed circuits and electronics assembly chose the anniversary of President Biden issuing the Presidential Determination 2023-06, to lament the lack of investment in the US PCB industry. The Presidential order, signed in March 2023, invoked the Defense Production Act (DPA), which was designed to stimulate US investment in PCB manufacture and ‘related technologies’. According ...
