Microchip’s AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) addresses growing demand for Human-Machine Interfaces (HMIs) in automotive and e-mobility applications. Supporting sophisticated graphics and large display sizes (up to 10 inches with XGA resolution, 1024 × 768), the hybrid MCU SiP combines the MPU and memory into a single package. It features an Arm926EJ-S processor and 512 Mbit DDR2 SDRAM. Display ...
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The latest Electronics Weekly product news, ranging from Analogue and Asics to Software and Test.
Toshiba’s TPHR6704RL targets industrial switched-mode power supplies
Toshiba’s TPHR6704RL is a 40V, 0.67mΩ N-channel MOSFET aiming yo to improve efficiency for industrial power supplies. It uses U-MOS11-H technology, highlights Toshiba, to deliver ultra-low on-resistance, fast switching and improved EMI performance in switched-mode power supplies. For example, by minimising voltage spikes generated between the drain and source during switching. TPHR6704RL The company writes: “By adopting the U-MOS11-H process, ...
Sponsored Content: Reliable Interconnect Design Considerations for Collaborative Robot Systems
As collaborative robots (cobots) are increasingly deployed alongside human operators, their system architectures continue to evolve toward higher integration, reduced size and greater modularity. These trends place growing demands on interconnect design, as connectors must deliver stable electrical performance while accommodating motion, vibration, assembly tolerance and long-term mechanical stress within confined spaces. Unlike conventional industrial robots, cobots typically employ lightweight ...
Tria Technologies extends multi-OS support for Qualcomm hardware
Tria Technologies, the embedded compute board specialist, is expanding operating system support across its Qualcomm-based hardware. Yocto Linux, Windows 11 IoT, and Android are all now available, it announces. Android 16 Specifically, for Android, while support for version 13 of the OS is currently available, Android 16 is planned for Q4 2026, says Tria. The release brings mobile capabilities to ...
SmartRay ECCO X 050G 3D laser scanning sensor for reflective surfaces
SmartRay is extending its ECCO X sensor range, for 3D laser scanning, with a model featuring 3D scanning for highly reflective surfaces, the ECCO X 050G sensor. ECCO X 050G It has the capability to measure shiny, reflective and transparent surfaces, such as glass, for example, for automated optical inspection, for manufacturers of mobile phones, camera and eyewear lenses, as ...
Telonic adds Siglent SNA5000X-E VNAs
The Siglent SNA5000X-E vector network analyser (VNA) series, designed for RF measurement, is now available from Telonic Instruments. The two models in the SNA5000X-E series can be used for determining the Q factor, bandwidth, and insertion loss of a filter. They feature impedance conversion, movement of measurement plane, fixture simulation, and adapter removal/insertion adjustments. The VNAs have five sweep types ...
Direct Insight’s QSMP-20 SoM for smart devices sidesteps AI memory demand
Direct Insight, the system-on-module (SoM) specialist, has released its STM32MP235C-based QSMP-20 module. It features higher availability DDR3L RAM to sidestep AI-driven lead time and supply issues. This is a solder-down QFN-style SoM, providing a drop-in, pin-compatible upgrade for the QSMP-15, the company highlights. And there is lower-cost DDR3 RAM with shorter lead times to avoid the ongoing AI-lead pressure on ...
Recom RVP6501 transformer driver IC for discrete isolated power supplies
Recom’s new range of power ICs and SMD (Surface Mount Device) transformers, for building discrete DC/DC isolated power supplies, includes the RVP6501. This is a pin-compatible second-source alternative to the 6501-type push-pull transformer driver IC. The company highlights the two features of precise switch timing and over-current protection. This, it says, is to avoid the risk of flux imbalance core ...
Arrow, Microchip, Bourns, and Amphenol produce reference design for SPE
Arrow, Microchip , Bourns, and Amphenol have come up with an evaluation platform – the 10BASE-T1S REF_SPE_T1S reference design board. The design assists engineers in adopting Single Pair Ethernet (SPE) by addressing the magnetic connection that links data to the physical cable and enables system-level evaluation of signal integrity, EMC behaviour, and noise immunity in real-world applications. SPE performance is ...
JEDEC updates LPDDR5/5X SPD with Enhanced Mode Switching support
JEDEC has officially updated its LPDDR5/5X Serial Presence Detect (SPD) Contents standard, adding support for calculating recovery time when switching operating modes, with JESD406-5D. Bill Gervasi of Monolithic Power Systems, and chair of the JEDEC SPD Task Group, commented: “Reducing power consumption has become imperative for computing systems as the use of AI and other demanding applications accelerate. The updates to ...
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