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Ceva integrates modem IP for satellite and terrestrial terminals

Ceva NTN integrated modem IP

Launched at MWC in Barcelona, the PentaG-NTN is a 5G-NTN (non-terrestrial network) modem IP subsystem for satellite user terminals supporting LEO and MEO constellations. It enables satellite operators, constellation and terminal developers to accelerate 5G-NTN services using the third-generation PentaG, production-ready 5G-Advanced baseband architecture. The modem integrates baseband hardware, L1 PHY software and verification assets into a single, reusable subsystem. ...

Pickering develops software tool for signal path testing

Pickering Test Test System Architect

Test System Architect is a graphical toolset developed for signal path design and deployment by signal switching and simulation specialist, Pickering Interfaces. The toolset is available free of charge and can be used to design, confiture and visualise test architectures, explained Kyle Voosen, product marketing manager at Pickering Interfaces. Voosen said that the challenge faced by many customers today is ...

Wi-Fi HaLow module increase 2.4GHz range x10

Quectel MWC HiLow module

At MWC in Barcelona (2-5 March), Quectel Wireless Solutions launched the FGH200M long range, low power module. It is based on the IEEE 802.11ah wireless networking (Wi-Fi HaLow) protocol and has up to 10 times the range of traditional 2.4GHz Wi-Fi, said the company. The module is based on the Morse Micro MM8108 chipset and operates in the sub-1GHz license ...

Singapore lab replaces interposer copper with micro LEDs

nsc Innovation labs photonics interposer

Replacing copper in semiconductor packaging with microLED optical links increases data rates and speed while resolving the issues of heat generation encountered by more traditional designs. Singapore’s NSC (New Silicon Corporation) exhibited its latest project at Asia Photonics Expo 2026. Using silicon nitride waveguides and micro LEDs to connect, for example a GPU and high bandwidth memory results in 32Tbps/mm ...

Singapore shines as photonics centre as Asia Photonics Expo 2026 begins

Asia Photonics Expo 2026

The importance of Singapore as a technology hub was reinforced today at the opening of the Asia Photonics Expo (APE) 2026. This year’s APE (4-6 February) is at Sands Expo and Convention Centre, Singapore. The three-day conference and exhibition will host more than 350 exhibitors, from 17 countries and regions and expects to welcome 6,000 guests from 50 countries. “The ...

Powell adds Samtec’s latest high-density, high-speed connectors

Samtec AccelRate mP from Powell Electronics

Samtec’s 0.635 mm pitch AcceleRate mP series connectors are now available from Powell Electronics. The high-density, high-speed power and signal array connectors feature rotated power blades for efficient cooling in a compact form factor. The power blades are rotated at 90º angles which gives equal access to heat escape for uniform cooling, explains Samtec. It also simplifies the breakout region, ...

VLSI Symposium: 7bit 150Gsample/s DAC on 5nm CMOS

Imec PAM4 DAC-VLSIa

Imec built a 7bit 150Gsample/s digital to analogue converter using 5nm finfet CMOS. Revealed at the Symposium on VLSI Technology and Circuits in Kyoto, it achieves data rates of up to 300 Gbit/s using PAM-4 modulation, said the Belgian research institute, which is aiming it at data centres. “PAM-4 has emerged as the preferred modulation scheme in data centres, enabling ...

Master Electronics adds RF modules with Insight SiP signing

NEWS-Nick-Wood_Sales-Marketing-Director_Insight-SIP-300x200.webp

US-based Master Electronics has added RF modules to its offering with the signing of French RF module specialist, Insight SIP. The distributor is based in Phoenix, Arizona but ships worldwide as Online Components for web-based distribution and trades as Electro Sonic in Canada. The company credits the combination of  online e-commerce and field sales, organic growth and strategic acquisition for ...

Plug-in module connector design rises to VPX challenges

TE-Connectivity-MultiGig-HD-2-298x200.webp

TE Connectivity’s MultiGig HD connector has been selected by the VITA Standards Organization as the next-generation VPX plug-in module connector. Senior project manager, Mark Walmsley, revealed the VITA 100.30 connector plug-in module at Embedded Tech Trends. The modules features powerblades and stripline (four layer) wafers to optimise isolation. The wafers are thicker than those used for VPX and have key ...

Embedded World: Click board offers LTE-M and NB-IoT comms

MicroE lte-iot-10-click on protoboard

Mikroe has introduced a dual-mode LTE-M and NB-IoT tranceiver in its ‘Click’ board circuit prototyping format. Called ‘LTE IoT 10 Click’, it is built around Sequans’ Monarch GM02S IC, which supports global 617MHz to 2.2GHz operation. The board is 3GPP LTE Release 14 compliant, and can be upgraded to Release 17, according to Mikroe. Transmission is at up to +23dBm, ...