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The latest news, developments and announcements from around the electronics industry.

Microchip’s SAM9X75D5M hybrid MCU SiP targets automotive HMIs

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Microchip’s AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) addresses growing demand for Human-Machine Interfaces (HMIs) in automotive and e-mobility applications. Supporting sophisticated graphics and large display sizes (up to 10 inches with XGA resolution, 1024 × 768), the hybrid MCU SiP combines the MPU and memory into a single package. It features an Arm926EJ-S processor and 512 Mbit DDR2 SDRAM. Display ...

EW BrightSparks 2025 profile: Osian Jones, Compound Semiconductor Catapult

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Now in its eighth year, the EW BrightSparks awards see Electronics Weekly celebrate some of the brightest and most talented young engineers in the UK today. In the next in our series on the latest EW BrightSparks of 2025, we profile Osian Jones, who was an intern at the Compound Semiconductor Catapult (CSA) last year. He is studying at Swansea University ...

2025 Raspberry Pi revenues up 25% YoY

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Four million Raspberry Pis were shipped in H2 2025, and a total of 7.6 million for FY 2025, up 9% over FY 2024. Revenue was $323 million – up 25% YoY. EBITDA was $46.4 million, up 25% over FY 2024, supported by strengthening demand and favourable unit economics through H2. The gross profit per unit was $8.7 at a margin ...

Molex buys Smiths Interconnect

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Molex has completed the acquisition of Smiths Interconnect, a subsidiary of UK-based Smiths Group. Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedized custom connectors, contacts, RF components and optical transceivers for harsh environments. Smiths Interconnect also brings leading semiconductor test capabilities that complement Molex’s data communications and data center solutions to support growth in ...

Nvidia invests $2bn in Marvell for AI ASIC compatibility

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Nvidia is to invest $2 billion in Marvell to ensure that Marvell’s customers for datacentre ASICs have a route to compatibility with Nvidia’s computing platform. With the hyperscalers developing their own ASIC custom silicon for datacentres, as an alternative to buying Nvidia GPUs, Nvidia aims to ensure that Marvell’s custom chips can remain compatible with Nvidia’s datacentre hardware. Marvell is currently ...

2026 semiconductor capex to increase 20% YoY

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Semiconductor industry capex was $166 billion in 2025, up 7% YoY, says Semiconductor Intelligence (SI). SI estimates 2026 capex will be $200 billion, up 20% from 2025. TSMC was the largest spender in 2025 with $40.9 billion in capex, 25% of the total. TSMC projects 2026 capex will be between $52 billion and $56 billion, an increase of 27% to ...

NIST develops high temperature photonics packaging

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IollNIST (The US National Institute of Science and Technology) scientists have developed a new process for packaging photonic integrated circuits so they can survive and operate in some of the most extreme environments imaginable. The advance could allow photonic chip-based technologies to operate in deep-space probes, inside nuclear reactors, in ultrahigh vacuum systems, and at temperatures both near absolute zero ...

Notebook shipments to fall 14.8%

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Notebook shipments are set to fall 14.8% YoY, says TrendForce. Further price hikes are expected in the coming quarters. A tight memory supply continues to push up system costs, while price adjustments to CPUs and fluctuations in supply availability are further deteriorating cost structures with  brands increasingly compelled to raise retail prices to maintain profitability. Market polarisation among notebook brands ...

Farnell signs Same Sky

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Farnell has signed a worldwide distribution agreement with Same Sky, a manufacturer specialising in  interconnect, audio, thermal management, motion and control, relay, sensor, and switch solutions.  This partnership expands the global availability of Same Sky’s portfolio, ensuring  immediate customerbaccess to high-performance component technologies. By integrating Same Sky’s technical depth into Farnell’s global infrastructure, the collaboration supports high-stakes design challenges in ...

ESA awards OHB Sweden the EPS‑Sterna constellation contract

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The European Space Agency (ESA) has selected OHB Sweden to build 20 small satellites for the EUMETSAT Polar System – Sterna (EPS‑Sterna) constellation. EUMETSAT is the European Organisation for the Exploitation of Meteorological Satellites. The programme will also involve AAC Omnisys, a subsidiary of AAC Clyde Space, who provides the mission’s meteorological payload. This is a Gothenburg‑developed microwave radiometer. EPS‑Sterna ...