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Rohm buys Irish digital power chip firm

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Rohm has completed the acquisition of Irish power management IC developer Powervation for $70m. This a second acquisition for Rohm this year as it builds its power IC business on the back of its own core high voltage power semiconductor technology which includes the new “wonder technology” silicon carbide. In May,  Rohm bought Renesas’ 8-inch wafer fab in Shiga. The line will ...

ARM warms to FD-SOI

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FD-SOI is becoming an interesting technology for the mobile SoC market, reckons ARM. I think it’s very interesting,” ARM evp Pete Hutton told Electronics Weekly, “if you look at low-power/low-cost a lot of people are sticking at 28nm and not moving to 16nm finfet because it’s much more expensive. 22nm FD-SOI gets you the performance and it’s not much more ...

ARM sales leap, record processor licences signed

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ARM saw Q2 revenues rise 15% to $357 million and profits rise 32% to $192 million. A record 54 processor licences were signed and one new subscription licence was signed with a major Chinese OEM. Other points highlighted by ARM include: 7 ARMv8-A processor licences signed, including three lead licences for next-generation processors 9 Mali multimedia processor licences were signed, including ...

SEMI book-to-bill languishes

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The SEMI book-to-bill was 0.98 in June. So far this year it has been 1.04 in January , 1.03 in February , 1.10 in March , 1.04 in April and 0.99 in May. June bookings were $1.51 billion – 2.6% down on May’s $1.55 billion, and 3.5% higher than the June 2014 bookings of $1.46 billion. June billings were $1.54 billion ...

Toshiba clear-out following scandal

Toshiba CEO Hisao Tanaka, vice chairman and former CEO Norio Sasaki and company adviser and former CEO Atsutoshi Nishida have all resigned as of today following seven years of false accounting initiated under Nishida. Nishida was CEO from 2005-9, and Sasaki was CEO from 2009 to 2013 when Tanska took over. The chairman, Masashi Muromachi, is to take the CEO ...

Cadence and UltraSoC debug IP for Xtensa

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UltraSoC and Cadence are supporting the Tensilica Xtensa family of processors within UltraSoC’s UltraDebug universal SoC debug solution. The IP will be available for integration and tapeout in early Q3 2015. Xtensa technology enables the system architect to create power-efficient, high-performance processors and DSPs customized to the exact needs of their design. This, in turn, allows the creation of SoCs ...

French firm wins Lapis Semi Bluetooth antenna design in

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Insight SiP of Sophia Antipolis is behind the PCB antenna design in the latest Bluetooth module of Lapis Semi. Called MK71050-03, it uses Lapis’ MK7105 silicon whose tranciever achieves <9mA transmit and receive. “The internal pattern antenna optimised for the ML7105 was developed in collaboration with Insight SiP,” said Lapis. “The EEPROM, crystal oscillator, and antenna matching circuit required are included ...

Plessey ride for Prostate Cancer UK

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Plessey Semiconductors will host its annual, corporate hospitality and charity ride on Thursday 3rd of September 2015, to raise funds for Prostate Cancer UK. The picture shows the Plessey cycle team. The funds raised will help to provide support and information to men and their families, fund research into the causes and treatments of the disease, and campaign to give ...

Digital hydraulics win Royal Academy of Engineering MacRobert Award

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Edinburgh-based Artemis has won this year’s MacRobert Award from the Royal Academy of Engineering. It won it for its Digital Displacement digitally-controlled hydraulic power system for off-shore wind turbines. “The smart modular system has been designed to overcome the significant reliability issues associated with existing turbines,” said the Academy. “The Artemis system is a massive leap forward for hydraulically powered ...