Home » Markets » AI

Singapore lab replaces interposer copper with micro LEDs

Replacing copper in semiconductor packaging with microLED optical links increases data rates and speed while resolving the issues of heat generation encountered by more traditional designs.

nsc Innovation labs photonics interposer

Singapore’s NSC (New Silicon Corporation) exhibited its latest project at Asia Photonics Expo 2026. Using silicon nitride waveguides and micro LEDs to connect, for example a GPU and high bandwidth memory results in 32Tbps/mm operation, compared to ~1.5Tbps/mm using copper, explained Niu Jing, a scientist at NSC.

There is no fibre alignment or lasers needed as the light is self-contained in the chip itself. Another advantage is that equivalent copper traces on existing interposers require greater power and therefore cause additional heating.


The research lab is working with commercial foundries such as Tower Semiconductor and the first tapeout is expected in the middle of this year.


NSC spun out from a research group within MIT’s research enterprise, the Singapore-MIT Alliance for Research and Technology (SMART) which conducted research into semiconductor and materials integration for the Low Energy Electronic Systems (LEES) research group. It describes itself as a “playground of creativity and a laboratory for exploration”. It encourages collaboration for chip design for innovation in extended reality, mobility, smart lighting, telecommunications and wearables.

Eye tracking AI glasses for cyclists

Caroline Hayes

Caroline Hayes

Caroline Hayes is the editor of Electronics Weekly. She has been covering the electronics industry for over 30 years, edited UK and pan-European titles and contributed to UK and international online and print publications. Although specialising in the semiconductor market, she also has a keen interest in education, careers and start-up opportunities in the broader electronics industry.

Leave a Reply

Your email address will not be published. Required fields are marked *

*