The power blades are rotated at 90º angles which gives equal access to heat escape for uniform cooling, explains Samtec. It also simplifies the breakout region, increases current capacity and reduces crowding, said the company. The open-pin-field layout is designed to enhance routing and grounding flexibility, added Powell. Configurations include up to eight power and 240 signal positions.
The low-profile connectors are available in standard stack heights of 5mm and 10mm – although Samtec has said that 16mm versions are also on its roadmap.
The connectors support up to 64Gbps PAM4 (32 Gbps NRZ) and are PCIe 6.0/CXL 3.2 capable, making them suitable for AI, HPC and datacom applications.
The design also includes weld tabs for secure board-level attachment and polarised guide posts for reliable blind mating. Optional alignment pins are also available for applications which require additional mating accuracy.
“The AcceleRate mP series represents a major step forward in high-density interconnect design,” commented Gary Evans, European director at Powell Electronics. “As next-generation compute and networking architectures push the limits of power, speed, and space, this platform provides the performance and flexibility engineers need to move confidently into the next era of system design.”
Powell Electronics specialises in components for high-rel applications (defence, aerospace and industrial uses).
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