He asks: What if your processor, memory, and power were already solved – before you even start your design?
In the interview, Greg also explains how System-in-Package (SiP) technology is transforming embedded development. By integrating processors from Texas Instruments, STMicroelectronics, and AMD with DDR memory, power management, and hundreds of passives and other components into a single IC, Octavo eliminates the most time-consuming and risk-prone parts of hardware design, he tells us.
Thank you to Greg for his time.
Read the full Electronics Weekly news roundup from Embedded World 2026 »
Video: emap – Connor Moody
