Microprocessors

Microchip’s AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) addresses growing demand for Human-Machine Interfaces (HMIs) in automotive and e-mobility applications. Supporting sophisticated graphics and large display sizes (up to 10 inches with XGA resolution, 1024 × 768), the hybrid MCU SiP combines the MPU and memory into a single package. It features an Arm926EJ-S processor and 512 Mbit DDR2 SDRAM. Display ...

Direct Insight, the system-on-module (SoM) specialist, has released its STM32MP235C-based QSMP-20 module. It features higher availability DDR3L RAM to sidestep AI-driven lead time and supply issues. This is a solder-down QFN-style SoM, providing a drop-in, pin-compatible upgrade for the QSMP-15, the company highlights. And there is lower-cost DDR3 RAM with shorter lead times to avoid the ongoing AI-lead pressure on ...

Arm has designed its first production silicon proprietary CPU which sits, in the integration hierarchy, between Arm’s IP portfolio and its Compute Subsystems products. The processor, designated Arm AGI CPU, is targeted at agentic AI infrastructure. Arm says it delivers more than two-times performance per rack compared with x86 platforms. “Today marks the next phase of the Arm compute platform ...

Alibaba’s research arm, Damo Academy, has launched a Risc-V based CPU for AI inference, which can be customised to a user’s workload and is claimed to be the highest-performing Risc-V processor in the world. Called the XuanTie C950, it is a 5nm, 3.2GHz processor aimed at competing in the worldwide AI chip market. Alibaba CEO Eddie Wu says he is ...

APEC 2026: Power Integrations has implemented its GaN technology in its TOPSwitch flyback ICs to increase the power range to 400W. The company’s PowiGaN technology means that the flyback converters more than double power output to extend the power range above the conventional 250W to 440W for faster charging for e-bikes, mobility devices and industrial applications. They also exceed ErP ...

Unifying embedded software files, datasheets and applications notes for Renesas’ RA family of MCUs, Renesas 365 is the company’s cloud-based environment for system development, device lifecycle management and concept validation. It is powered by Altium and, according to Renesas Electronics, is the first platform to bring silicon and systems together across an open ecosystem at scale. It allows engineering teams ...

NVIDIA today announced the NVIDIA Vera Rubin platform is opening the next frontier of agentic AI, with seven new chips now in full production. They are: the NVIDIA Vera CPU, NVIDIA Rubin GPU, NVIDIA NVLink;6 Switch, NVIDIA ConnectX-9 SuperNIC, NVIDIA BlueField-4 DPU and NVIDIA Spectrum-6 Ethernet switch, as well as the newly  NVIDIA Groq 3 LPU. Designed to operate together ...

At Embedded World, TI  introduced two MCU families with edge AI capabilities. The MSPM0G5187 and AM13Ex MCUs integrate TI’s TinyEngine NPU accelerator for MCUs that optimises inference operations. Production quantities of the MSPM0G5187 MCU are available for purchase on TI.com, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of ...

Ubitium of Dusseldorf, the developer of a universal embedded processor, has taped-out its first silicon. “Our Universal Processor does it all – CPU, GPU, DSP, FPGA – in one chip, one architecture,” says CEO Hyun Shin Cho. Ubitium believes that the wide variety of embedded processors can be replaced by a universal processor. Built on Samsung Foundry’s 8nm process using ...

A webinar date for your diary, if you are keeping up with the latest Arduino microcontroller development board: “From board to build: Using UNO Q and App Lab”. The DigiKey webinar, which is sponsored by Arduino, will take place on Thursday 12 February at 9am CST (3pm GMT). The Uno Q is Arduino’s Linux-capable version of its Uno. The board ...