JEDEC has officially updated its LPDDR5/5X Serial Presence Detect (SPD) Contents standard, adding support for calculating recovery time when switching operating modes, with JESD406-5D. Bill Gervasi of Monolithic Power Systems, and chair of the JEDEC SPD Task Group, commented: “Reducing power consumption has become imperative for computing systems as the use of AI and other demanding applications accelerate. The updates to ...
At Embedded World 2026 we caught up with Coby Hanoch, CEO of Weebit Nano, as part of our promotional coverage for the event. He explains why we need a new kind of NVM (Non-Volatile Memory), which big companies are using, and how it enables new embedded applications in AI, compute in memory and neuromorphic. Thank you to Coby for his ...
Micron has begun volume shipment of its HBM4 36GB 12H designed for NVIDIA Vera Rubin and capable of over 11 Gb/s pin speeds, enabling a bandwidth greater than 2.8 TB/s. Micron is also sampling HBM4 48GB 16H which stacks 16 HBM die. “The next era of AI will be defined by tightly integrated platforms developed through joint engineering innovations – ...
The memory shortage could last another four to five years, says the chairman of SK Group, Chey Tae-won. The supply of base wafers is lagging demand by more than 20%, says Chey. “AI actually wants to have a lot of HBM, and once you make the HBM…we have to use a lot of wafers,” said Chey, “So we need some ...
JEDEC has announced an update of the DDR5 Serial Presence Detect (SPD) Contents standard, JESD400-5D. The SPD data is used by a system’s BIOS to properly initialise and optimise memory channels. The annual release – this is version 1.4 – adds support for memory modules executing up to DDR5-9200 speeds. There are also codes for the new Small Outline Compression ...
The European electronic components distribution market is suffering from a declining automotive sector, reports DMASS Europe. The electronic components distribution industry body represents approximately 85% of the European components DTAM. DMASS said that European semiconductor distribution sales in Q2 2025 fell 14% compared to Q2 2024. Austria experiencing the steepest drop (36.6%) followed by France (20%), Germany and Ireland both ...
IQE and Quinas Technology say they have successfully completed their £1.1m UltraRAM industrialisation project. This involved developing a scalable gallium antimonide (GaSb) epitaxy for memory devices. In July 2024 they were awarded the year’s funding by Innovate UK to take UltraRAM further towards mass production. Quinas Technology is the startup founded by IQE and the universities of Lancaster and Cardiff. ...
On March 3, Longsys (SZ.301308), a branded semiconductor memory enterprise, made its first-ever appearance at MWC 2025 in Barcelona. Under the theme “New Mode of Storage Empowering Global Mobility”, it showcased a series of innovative storage products, attracting widespread attention. PTM Business Model: Full-Stack Customization Service The Product Technology Manufacturing (PTM) model was a major highlight, showcasing Longsys’ full-stack customization ...
Memory tokens and receptacles in the Datakey Bar series now include the Mini-Bar which has been designed by ATEK Access Technologies to provide a memory system for handheld applications. The portable memory tokens and mating receptacles are more than 60% smaller than the equivalent Bar receptacle models, said the company. There are two versions available. The MBRHN has an eight-pin ...
Hynix was showing off a sample of its 321-layer 1Tb TLC NAND chips at The Flash Memory Summit earlier this week, though volume production isn’t due until 2025. Hynix used a CMOS under Array (CuA) technology which involves moving the peripheral circuitry under the cells. The company calls its peri under cell (PUC) technology ‘4D NAND’. It is not revealed ...
