Digital Integrated Circuits

In the latest CHIIPs podcast, Thomas Andersen, vice president for AI and machine learning at Synopsys, shatters the threat of AI for design engineering jobs as he discusses the use of AI by the EDA industry. It will be most beneficial where there is reuse, he believes, outlining how AI can be taught a design, and self-learning will allow it ...

The importance of Singapore as a technology hub was reinforced today at the opening of the Asia Photonics Expo (APE) 2026. This year’s APE (4-6 February) is at Sands Expo and Convention Centre, Singapore. The three-day conference and exhibition will host more than 350 exhibitors, from 17 countries and regions and expects to welcome 6,000 guests from 50 countries. “The ...

STMicroelectronics is aiming at Matter 1.5 smart-home networking with a 2x3mm NFC chip called ST25DA-C. “The ST25DA-C secure NFC tag can operate cryptographic operations required for Matter device commissioning using energy harvesting from the RF field,” according to the company. “This mechanism allows users to add unpowered devices to the smart home network. It also simplifies the installation of multiple ...

Toshiba has put single logic gates into the 1 x 1.45mm XSON6 package, in two series with differing input characteristics. 12 of them are in the 7UL1G series, which operate across 0.9 to 3.6V and have input thresholds that are a ratio of the power rail up to Vdd = ~2V, above which they become fixed-voltage – see the data ...

The latest research from DMASS Europe, the European components distribution body, shows a slight upturn in semiconductors, interconnect, passive and electromechanical (IPE) sectors. DMASS Europe‘s chairman, Hermann Reiter, said that after a “prolonged period of stagnation, the European electronic components market is showing the first signs of renewed momentum” but warned  “structural dependencies and supply chain vulnerabilities remain a critical ...

Toshiba has introduced four dual-channel 150Mbit/s digital isolators in 4.9  x 6 x 1.75mm surface-mount packaging. Options allow two channels in one direction, or one channel in each direction, and outputs that default high or low. They are: DCL520C00 2x forward, defaults low DCL520D00 2x forward, defaults high DCL521C00 1x forward, 1x reverse, defaults low DCL521D00 1x forward, 1x reverse, ...

A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package. Saras’ approach is for vertical power delivery to reduce parasitic losses. Stacking the power stage and passive components in line with the die shortens the power path and reduces parasitic ...

Aiming at lithography, Texas Instruments has created a digital micromirror device (DLP) with 8.9 million pixels that update at 110Gpixel/s. “Mask-less digital lithography machines – which project light materials without a photomask or stencil – are becoming increasingly popular for the manufacturing advanced packaging [that] combines multiple chips and technologies into a single package,” according to the company. DLP991UUV, as ...

At Microelectronics UK (24-25 September), Kanishka Narayan, Minister of State for semiconductors, emerging technology, AI and online safety announced investment designed to support the UK semiconductor industry. The exhibition and conference for the microlectronics supply chain was held in London’s Excel Centre. In his keynote, the minister highlighted that the government is investing £10m in a new initiative with Innovate ...

Silicon Labs has announced that the first SoC in its Series 3 family will be PSA-certified to Level 4. The company believed the SiXG301 will be the first PSA Level 4 iSE/SE -certified device. The certification is for hardware and software protection, using crytpographic algorithms and protects against higher level attacks, such as differential power analysis, in IoT and edge ...