CBM300S is a 300W fan-less ac-dc baseplate-cooled PSU, delivering 360W peak, in a 107 x 85 x 20mm brick. Made by Cinon and available through Relec, the supplies have closed-box construction and can accept power from 90 – 264Vac or 120 – 370Vdc. Different version offer outputs at 12, 15, 24, 28, 36, 48 or 54V. These can be trimmed ...
Toshiba has launched three industrial 650V SiC mosfets in TOLL packaging, with on-resistance as low 27mΩ. “The TOLL package is a 9pin, four-terminal package designed to facilitate the use of a Kelvin connection for its signal source terminal for the gate drive,” said the company. “The surface mounting capability of the TOLL package allows for smaller parasitic impedance, which leads ...
Drive System Design has announced a >200kW hydrogen fuel cell-based power train module for trucks and buses. It is the outcome of ‘Project Archer’, a programme part-funded by the UK’s Advanced Propulsion Centre. Intelligent Energy led Archer, building the fuel cell around its own existing stack design. Gems (General Engine Management Systems) Performance Electronics developed an electronic control unit for ...
ABB motor is claiming record energy efficiency for a multi-MW motor. “The motor, destined for a steel plant in India, has achieved an efficiency rating of 99.13% during testing, a substantial improvement over ABB’s previous world record of 99.05% set in 2017,” according to the company. “Getting closer to 100% efficiency becomes increasingly challenging in terms of the motor design ...
Not all batteries are created equal. A pouch design changes characteristics for supercap technology, argues John Söderström. Batteries are a convenient, high-density store of energy. It is no accident that they are a mainstay of connected wireless and IoT devices. There is, however, a lot not to like about batteries: * Size and shape – cylindrical or coin cell batteries ...
Farnell Japan now offers customers Toshiba’s low-voltage mosfet portfolio, suitable for use in server AC-DC power supplies and basestation DC-DC converters. In May, Toshiba officially opened phase 1 of its Kaga wafer fab expansion. The facility in Japan’s Ishikawa Prefecture and brings online 300mm/12-inch wafer lines. Adrian Cotterill, Farnell’s power segment lead, commented: “Japan holds significant importance for us, and ...
The European electronic components distribution market is suffering from a declining automotive sector, reports DMASS Europe. The electronic components distribution industry body represents approximately 85% of the European components DTAM. DMASS said that European semiconductor distribution sales in Q2 2025 fell 14% compared to Q2 2024. Austria experiencing the steepest drop (36.6%) followed by France (20%), Germany and Ireland both ...
Toshiba has created a ~5A opto-isolated mosfet and IGBT gate driver in a six-pad SO6L package, half the size of an 8pin DIP package, and “meets the reinforced insulation class requirements of international standards”, it said. Called TLP5795H, it has an internal LED, photodiode and a rail-to-rail output driver typically capable of -4.5 and +5.3A with a 15 – 30V supply ...
Astrobotic, a lunar logistics company, has won a Nasa contract to develop its Extra Large Vertical Solar Array technology (VSAT-XL). Standing at 30m tall, they will have the ability to generate 50kW of power from the dual 20-meter-long solar panels. Astrobotic highlights that VSAT-XL would be the largest planned lunar power infrastructure to date. The plan is to meet the ...
Toshiba has picked its 4.9 x 6.1 x 1mm ‘SOP Advance(E)’ package for a pair of industrial n-channel mosfets: TPM1R908QM 80V 238A 1.68mΩ max TPM7R10CQ5 150V 120A 7.1mΩ max Maximum junction to case thermal resistance is 0.6°C/W (25°C) in each case. “The SOP Advance(E) package marks a substantial improvement over Toshiba’s existing ‘SOP Advance(N)’ package, reducing package resistance by approximately ...
