The latest electronics research news from within the industry and universities from around the world.
Belgian research lab Imec has revealed 3D stacked memory-on-GPU AI processor thermal data at IEDM (IEEE International Electron Devices Meeting) this week. The data comes from a thermal STCO (system-technology co-optimization) study of integrating high-bandwidth memory (HBM) on a GPU by stacking, which the lab describes as a promising compute architecture for next-gen AI applications. It has compared this ‘3D’ ...
Researchers at Virginia Tech have combined liquid metal and a heat-activated adhesive to create an electrically conductive patch that bonds to fabric when heated with a hot iron. “E-textiles and wearable electronics can enable diverse applications from health care and environmental monitoring to robotics and human-machine interfaces,” said Virginia Tech engineer Michael Bartlett. “Our work advances this by creating iron-on ...
Lancaster University has been awarded a Queen Elizabeth Prize for Education in recognition of its work for the BBC micro:bit. It is the UK’s highest education honour. The sole academic institution involved with developing the device, Lancaster University created the micro:bit’s run-time operating system. And it also helped deliver the hardware and shaped the coding experience. The handheld, programmable STEM ...
Fraunhofer and the Taiwanese research institute TSRI are developing ferroelectric field-effect transistors (FeFETs) made from hafnium oxide to produce energy efficient memory ICs. A key bottleneck in datacentres is the transfer of data between main memory and the computing unit. FeFETs will enable computing “directly in memory”, with lower latency and energy consumption. “We are designing a platform that more ...
The IPERLITE mission is an in-orbit demonstration (IOD) flight designed to demonstrate next-generation hyperspectral imaging technology in space from an orbit of 510 km. At the core of the IPERLITE mission is a hyperspectral sensor developed by imec, the result of a multi-year ESA-supported R&D trajectory involving several Belgian partners and building further on earlier CHIEM and CSIMBA projects. Rather than ...
Princeton researchers have developed a diamond-based quantum sensor that can measure magnetic phenomena at the nanometre scale. “The technique uncovers fluctuations that are beyond the reach of existing instruments and provides key insight into materials such as graphene and superconductors,” according to the university. “The underlying diamond-based sensing methods have been under development for half a decade. But the team ...
Researchers from the universities of Birmingham, Oxford and Bristol have developed a new durable material that converts motion into electricity (piezoelectricity) with greater efficiency, without using toxic lead, offering advantages for sensors, wearable electronics and self-powered devices. Based on bismuth iodide, an inorganic salt with low toxicity, the new soft, hybrid material rivals the performance of traditional lead-based ceramics but ...
Imec is to launch a regional R&D hub in Qatar in early 2026 supported by Invest Qatar and the Qatar Research, Development & Innovation Council (QRDI). The signing of the agreement was witnessed by H.E. Sheikh Faisal bin Thani bin Faisal Al Thani, the Minister of Commerce and Industry, H.E. Mr. Mohammed bin Ali Al Mannai, Minister of Communications and ...
The NanoIC pilot line, a European initiative coordinated by imec for accelerating innovation in process technologies beyond 2nm, has released the N2 P-PDK v1.0, an important update of its N2 Pathfinding Process Design Kit (P-PDK). This new version introduces several new features, including a library of 29 SRAM memory macros, allowing designers to explore and benchmark system-on-chip (SoC) designs with ...
Fraunhofer and X-Fab are joining forces in a ‘Lab-in-Fab’ co-operative approach that integrates research, development, manufacturing and commercialisation to accelerate the transition of microtechnology innovations into industrial-scale production. The technical focus of the collaboration is on advanced packaging and heterogeneous integration of electronic components and systems. The Lab-in-Fab model enables efficient development of new processes and technologies in the fields ...
